For electronic manufacturers assembling printed circuit boards, an SMT reflow oven is a must-have piece of equipment. Individuals primarily use reflow ovens for the thermal processing of soldering surface-mount electronic components to circuit boards. The ovens have anywhere from eight or more zones, which you can individually control for temperature. These zones are for heating a printed circuit board to thermal set points, and they are followed by cooling sections. Every porotype PCB has its own set temperature standards the product needs to hit in each zone while making its way through the reflow oven. PCB Unlimited offers various solder reflow ovens with options to accommodate low to high volumes. From benchtop batch solder reflow ovens to automatic floor-style systems, you can find the ideal SMT reflow oven to suit your needs at PCB Unlimited today.

M10 Lead free Reflow oven is specially designed for mid-high volume production.
  • 10 upper and 10 bottom forced hot air convection zones allow high quality lead-free soldering with uniform heating and exceptional process stability
  • Temperature accuracy of ±1°C, ensure the best temperature control across the Printed Circuit Board Assembly
  • Mass production requirement in the range of 900-1400pcs/8hours (Take 300x300 PCB as reference)
Clock fast Lead Time: 4 weeks Money orange $33,950.00
Higher throughput SMT reflow oven with 20" (508mm) wide conveyor for production runs. The 2000HT hot-air reflow system utilizes our patented Horizontal Convection Heating technology with digital temperature controls for extremely uniform air circulation and temperature profiling across the board – providing enhanced process control. The soldering does not exceed limits acroos the board so every SMD is protected. The unit is available with maximum heating temperature of 250°C (482°F) for lead solder or hotter 400°C (752°F) for lead-free solder operation.

Clock fast Lead Time: 4 weeks Money orange $26,995.00
This convection reflow oven is ideal for mid-to-high volume lead-free soldering production lines.
  • 8 upper and 8 bottom forced hot air convection zones allow high quality lead-free soldering with uniform heating and exceptional process stability
  • Temperature accuracy of ±1°C and a high-speed CE certificated blower for maximum convection
  • Individual temperature control for all zones
Clock fast Lead Time: 4 weeks Money orange $24,750.00 $23,512.00
This convection reflow oven is ideal for mid-to-high volume lead-free soldering production lines.
  • 6 upper and 6 bottom forced hot air convection zones allow high quality lead-free soldering with uniform heating and exceptional process stability
  • Temperature accuracy of ±1°C and a high-speed CE certificated blower for maximum convection
  • Individual temperature control for all zones
Clock fast Lead Time: 4 weeks Money orange $21,850.00 $19,665.00

The GF 125 HC Convection reflow oven for PCBs with 5 zones on top and five bottom vertical heating zones, the NEW GF-125 HC/HT is an economic solution for automatic medium volume production runs. Utilizing horizontal convection heating technology, the GF-125 HC/HT provides uniform temperature profiling across the entire PCB board for enhanced SMT process control. With temperatures up to 400°C, the GF-125 horizontal convection reflow oven is capable of lead-free soldering.

Clock fast Lead Time: 4 weeks Money orange $17,995.00
Reflow oven with five (5) top and five (5) bottom vertical heating zones, the ERO-500 is an economic solution for low to medium volume production runs. Utilizing plenum convection heating technology, the ERO-500 provides uniform temperature profiling across the entire PCB board for enhanced SMT process control. With a maximum high soldering temperature of 320°C, the ERO-500 is compatible with most lead and lead-free solder paste profiles.
Clock fast Lead Time: 4 weeks Money orange $16,950.00

This convection reflow oven is ideal for low-volume lead-free printed circuit board soldering production lines.

  • 6 upper and 6 bottom forced hot air convection zones allow high quality lead-free soldering with uniform heating and exceptional process stability
  • Temperature accuracy of ±1°C and a high-speed CE certificated blower for maximum convection
  • Individual temperature control for all zones
Clock fast Lead Time: 4 weeks Money orange $16,800.00 $15,960.00
The Mistral 360 convection reflow soldering system uses re-circulated hot air to accomplish reflow at much lower temperatures than IR systems. Using constant, even heating, a great variety of board sizes will reach reflow temperature with the same heat profile. By eliminating set-up time your production line can work to its fullest capacity.
Clock fast Lead Time: 4 weeks Money orange $16,406.00
Three (3) heating zone reflow ovens for batch production runs utilizing our patented Horizontal ConvectionTM Heating technology for extremely uniform temperature profiling across the printed circuit board for enhanced process control. The GF-120HT is lead-free compatible for RoHS compliant soldering.
Clock fast Lead Time: 4 weeks Money orange $13,500.00 $12,825.00

This convection reflow oven is ideal for low-volume lead-free soldering production lines.

  • 4 upper and 4 bottom forced hot air convection zones allow high quality lead-free soldering with uniform heating and exceptional process stability
  • Temperature accuracy of ±1°C and a high-speed CE certificated blower for maximum convection
  • Individual temperature control for all zones
Clock fast Lead Time: 4 weeks Money orange $12,560.00
The Mistral 260 convection reflow soldering ovens use re-circulated hot air to accomplish reflow at much lower temperatures than IR systems. By eliminating the set-up time, your production line can work to its fullest capacity!
Money orange $10,045.00
The GF-12HT SMT Reflow Oven uses a patented Horizontal Convection™ technology that circulates heated air in each chamber around the printed circuit board front to back which increases the thermal efficiency and uniformity within each zone. This exposes the circuit boards to a uniform temperature profile along the entire SMT PCB assembly. Cyclonic generator speed is independently set in each zone.
Clock fast Lead Time: 4 weeks Money orange $8,995.00 $8,545.00
The Gold-Flow™ GF-B-HT Shuttle Batch oven was designed for prototyping printed circuit board assembly and batch production runs. Capable for lead or lead-free soldering. While one PCB is being processed, another circuit board can be cooled and off-loaded, then a third board can be loaded and shuttled into the chamber for reflow
Clock fast Lead Time: 4 weeks Money orange $4,950.00

GF-DL-HT Dual Hot Plate is used for a variety of heating applications which include preheat, rework, reflow and curing of printed circuit board assemblies.The GF-DL-HT is capable of lead and lead free, high temperature applications and has dual programmable, two digital temperature controllers for precise temperature regulation.

Clock fast Lead Time: 4 weeks Money orange $2,195.00
GF-SL-HT Hot Plates Lead-free and lead soldering, single function hot plate with programmable digital temperature control and 13" x 13" (330mm x330mm) heating area.
Clock fast Lead Time: 4 weeks Money orange $1,450.00 $1,377.00
The T200 Series Reflow Ovens are ideal for low volume prototype printed circuit board assembly. One of the favorites in labs, universities and schools. These ovens can handle most of your SMT prototype circuit board assembly needs.
Clock fast Lead Time: 7 Days Money orange $2,495.00
T200N+ lead free SMT batch reflow ovens, system includes a nitrogen inlet that will allow you to process printed circuit boards in oxygen free ambiance, perfect for your challenging lead free prototype PCB assembly projects. Nitrogen environment allows reduction of peak temperatures therefore nitrogen improves paste spread, increases wettability, and produces shinier, more aesthetically pleasing solder joints
Money orange $4,100.00