Main Features
- Outstanding reflow soldering quality for SMD and hybrid
- Cures SMD adhesive
- Two microprocessor-controlled heat zones
| Power requirements | 200 – 230 VAC. / 50-60Hz |
| Max. power consumption | 3680W |
| Pre-heat zone | 2180W |
| Reflow zone | 1500W |
| Max. PCB substrate surface | 300 x 370mm |
| Max. pre-heat time | 1–999sec. |
| Max. pre-heat temperature | 60 -240 °C |
| Max. reflow time | 1–999sec. |
| Max. reflow temperature | 100–290°C |
| Heat up time | approx. 8 minutes |
| Net weight | +/- 22Kg |
| Options (not standard) | N2 inert gas connection with flowmeter |