overview
Is a lead-free, precision benchtop reflow oven with Full Profile Control.
Forced air heating, fully automatic, tailored for prototyping and small-batch SMT production. With a max. top and bottom heating area of 320 × 220 mm and a clearance of 35 mm, it supports both single- and double-sided PCB assemblies.
Each heating area independently and selectively controlled, enabling precise thermal profiles. Its programmable temperature curve setting in graphical mode, combined with 4 built-in thermocouples and an interface for an external probe, allows real-time monitoring directly on the PCB.