Reflow oven utilizing our 100% patented forced air Horizontal Convection™ Heating technology provides for greater thermal uniformity and process control. The GF-12HT is lead -free compatible for RoHS compliant soldering.
Even though these benchtop ovens are small, the 3 vertical zones plus the cooling zone give remarkably accurate profiles for reflow applications. With the new patented Horizontal Convection™ technology*, the '-HT' models are fully compatible with Lead Free (RoHS compliant) soldering alloys.
The patented Horizontal Convection™ technology** circulates heated air in each chamber around the board front to back which increases the thermal efficiency and uniformity within each zone. This exposes the circuit board to a uniform temperature profile along the entire printed circuit board assembly. Cyclonic generator speed is independently set in each zone.
The temperature profiling accessory kit includes all the accessories you need to profile PC boards through your reflow oven. It is compatible with any ovens or profiling systems which use standard Ktype thermocouples.
All GF ovens have a nitrogen gas inserting option. With the isolated chamber design (recirculation of atmosphere within reflow zone) low oxygen levels are maintained while conserving nitrogen consumption.
|Heating Zones||3 top, 3 bottom|
|Cyclonics™ (forced air)||3|
|Electrical Power||220 VAC, 50/60 Hz
1Ø (3Ø option)
|Max Board Width||12”(305mm)|
|Max Board Height||1.375”(35mm)|
|Max. Temperature:||662°F (350°C)|
100 CFM max.
|Heating Technology||Forced air Horizontal Convection™|
|Heat Tunnel Length||26”(660mm)|
|PC Interface Option||Yes|
|Overall Dimensions||39”x 32”x 19”H
990 x 813 x 483 mm
|Approximate Weight||220 lbs (98 kg)|