Indium3.2 is an air or nitrogen reflow, water-soluble solder
paste specifically formulated to accommodate the higher
processing temperatures required by the SnAgCu, SnAg, SnSb,
and other Pb-free alloy systems. This product formulation offers
consistent, repeatable printing performance combined with
a long stencil life and sufficient tack strength to handle the
challenges of today’s high-speed as well as high-mix surface
mount lines. In addition to consistent printing and reflow
requirements, this solder paste offers superb wetting to the
various Pb-free metallizations and has exceptional low-voiding
performance on fine-pitch components, including BGAs and
CSPs.
$115.00
Lead Time: In Stock
