The BGA Reballer is delivered in a kit that is simple to use, cost effective and, best of all, reusable. It comes with necessary materials including replacement spheres/balls for the specific package.
Lead Time: 3 days - 3 weeks
The BGA Reballer allows the recovery of a good component by replacing the attachment solder balls with new ones. This allows the original component to be saved and the savings can be enormous, Ideally suited for printed circuit board prototyping.