Electroformed Frameless Stencils are nickel-based, electroform foils designed to work with stencil tensioning systems also known as Reusable Stencil Frames.
They do not need to be permanently glued in a frame.
Electroformed stencils offer the best paste release characteristics available and are frequently used for fine pitch (20 mil to 12 mil pitch) SMT applications on prototype printed circuit boards.
They are also used for µBGA's, Flip Chip, and Wafer Bumping (12 mil to 6 mil pitch).
Lead Time: 48-Hour Turn