|Refrigerated Shelf Life||1 year||0°C-12°C (32°F-55°F)|
|Unrefrigerated Shelf Life||3 months||< 25°C (< 77°F)|
Do not add used paste to unused paste. Store used paste separately; keep unused paste tightly sealed with internal plug or end cap in place. See AIM’s paste handling guidelines for further information.
Pre-Reflow: AIM DJAW-10 effectively removes M8 solder paste from stencils while in process. DJAW-10 can be hand applied or used in under stencil wipe equipment. DJAW-10 will not dry M8 and will enhance transfer properties. Do not over-apply DJAW-10. Do not apply DJAW-10 to stencil topside. Isopropanol (IPA) is not recommended in process, but may be used as a final stencil rinse.
Post-Reflow Flux Residue: M8 residues can remain on the assembly after reflow and do not require cleaning. Where cleaning is mandated, AIM has worked closely with industry partners to ensure that M8 residues can be effectively removed with common defluxing agents. Contact AIM for cleaning compatibility information.
Recommended Initial Printer Settings - Dependent on PCB and Pad Design
|Parameter||Recommended Initial Settings|
|Squeegee Pressure||0.4 - 0.7kg/25mm|
|Squeegee Speed||13 – 152 mm/second|
|Snap-off Distance||On Contact 0.00 mm|
|PCB Separation Distance||0.75 - 2.0 mm|
|PCB Separation Speed||3 - 20 mm/second|