Electroformed Framed Stencils are nickel-based, electroform foils designed to work with stencil tensioning systems also known as Reusable Stencil Frames. They do not need to be permanently glued in a frame.
Electroformed stencils offer the best paste release characteristics available and are frequently used for fine pitch (20 mil to 12 mil pitch) SMT applications on printed circuit boards. They are also used for µBGA's, Flip Chip, and Wafer Bumping (12 mil to 6 mil pitch).
Nickel Stencil Production Electroforming creates a nickel stencil with a unique gasketing feature that reduces solder bridging and minimizes the need for underside stencil cleaning. The stencil is created by imaging photoresist on a substrate (or mandrel) where the apertures are intended and then plating - atom by atom - the stencil around the resist to the desired thickness.
The nickel atoms are deflected by the photoresist to create a trapezoidal configuration. When the stencil is removed from the substrate, the top becomes the contact side to create the gasketing effect. This process provides near-perfect registration with no geometric limitations, smooth vertical side-walls with a built-in taper and low surface tension to enhance paste release.
|Suitable Applications||All Component Pitches|
|Aperture Dimensional Tolerances||± 0.0003”|
|Thickness Available||0.001” - 0.006” All thicknesses are available at increments of 0.0001” increments.|
|Positional Accuracy||± 0.0003”|