StencilQuik(tm) are flexible solder paste stencils manufactured from a polyimide film with a high temperature adhesive covered with a release liner. They serve as both your stencil and alignment device. * StencilQuik comes in a pack of 10 BGA rework stencils * Allows you to replace your own BGAs or CSPs without special training or large capital equipment expenditures * Acts as an insulating barrier between solder balls as the solder paste masks adjacent apertures increasing placement reliability * Simplifies BGA placement as you can "feel" the device settle into the apertures of the StencilQuik(tm)
Were designed to reliably and quickly replace leadless device packages such as QFNs or LGA packages. * StencilMate™ comes in a pack of 20 rework stencils * Alignment is simple. No need to use custom fixtures or frames. * The stencil is cut using a laser to your exacting device requirements. * Elimnate the need to use capital intensive equipment or require a high degree of skill.
These laser cut stencils are typically used to manually print a single component on a printed circuit board. * Maximum Size 2" x 2" * Available with or without flaps (Flaps facilitate handling) * Mainly used for PCB rework but can used for prototype PCB assembly of simple boards
StikNPeel(tm) greatly simplifies the ability to selectively print solder paste onto various areas of a PCB. Simply peel off the backing, place the StikNPeel(tm) onto the PCB and apply the paste. * StikNPeel comes in a pack of 10 stencils * This rework process overcomes many of the headaches of using metal stencils * Eliminates "smearing" of solder paste underneath the stencil * Co planarity between board and stencil is assured due to the adhesive backing on the stencil
Flip-Up Stencils are single site stencils, used to apply solder paste onto circuit board pads of BGA’s, QFN’s, QFP’s, TSOPS, PLCC’s, etc. * Great for QFN’s where the pads on the board are larger than the pads on the component. * All Flip Up stencils are made from stainless steel and are reusable after a quick wash in an alcohol based cleaner. * All Flip Up stencils are custom made to order per your specification.
CPF Stencils (or Component Print Frame) are used to apply solder paste directly onto BGA and Leadless components. * A CPF stencil makes for simple alignment when pasting, and serves as an excellent tool for applying paste when boards are highly populated. * All CPF stencils are made from stainless steel and are reusable after a quick wash in an alcohol based cleaner. * All CPF stencils are custom made to order per your specification. * Order contain stencil only. Please see accesories
The StencilQuik BGA Rework Kit includes all of the materials you need to place most BGAs that you will encounter. These rework tools packaged together along with your specified solder paste or tacky flux supplies you with the tools you need to place BGAs and other area array devices quickly and reliably. This kit equips you with the necessary StencilQuik stencils to place 0.5mm, 0.8mm, 1.0mm, 1.27mm, and 1.5mm pitch area array devices. Full array StencilQuik patterns can be customized by either trimming the stencil for smaller package sizes or by masking off the center areas to create a perimeter array. These flexible solder paste stencils remain in place on the site location becoming an integral part of the printed circuit board assembly