Off-shore PCBs | Off-shore PCB Fabrication and Assembly

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Part Number: *		Revision:
Quantities: *
Board Length (inches): *		Board Width (inches): *
Array Up:	Array Length (inches):	Array Width (inches):
Tab-Rout: Scoring:

# of layers:		Material Type:
Finish Thickness:		Finish Plating:
Copper Wt. (Outer):		Copper Wt. (Inner):
Soldermask:		Soldermask Color:
Silkscreen:		Silkscreen Color:
# of Fingers (one side):		Gold Thickness:
Min. Trace Space:		Min. Pitch:
Blind and Buried Hole:		Smallest Hole Size:

Advanced Features:
Plated Slots:	Plated Edges:	Controlled Dielectric:
Counterbore:	Countersink:	Controlled Impedance:
Blind Slot:

Process Capability
Spec 1	Spec 2		unit	Standard	Special
Image transfer	Min trace width/space in inner layer	1/2oz base	mil	4/4
		1oz base	mil	5/5
		2oz base	mil	8/8.5
		3oz base	mil	12/10.5
		4oz base	mil	18/14
	Min trace width/space in outer layer	1/2oz base	mil	4/4.7
		1oz base	mil	5/5.2
		2oz base	mil	9/9.5
		3oz base	mil	12/14
		4oz base	mil	18/21
	Compensation to inner layer (Hoz/1oz/2oz/3oz/4oz)		mil	0.5/1.0/2.5/3.5/6.0
	Compensation to outer layer (Hoz/1oz/2oz/3oz/4oz)		mil	1.2/1.7/4.5/6.0/9.0
	Inner layer isolation ring width(single side) (Min)		mil	10(≤6 layer);12(7-14 layer);14(layer≥14)
	Through hole min pad ring size (inner)		mil	5(1/2oz,1oz),6(2oz),8(3oz)
	Through hole min pad ring size (outer)		mil	4 (before compensation)
	Min inner layer isolation strip width(after compensation)		mil	8	7
	Min space from conductor to board edge in inner layer		mil	8	7
	Min space from conductor to board edge in outer layer		mil	8	6
	Min grid trace width/space finished size		mil	6/6(1/2oz Base); 6/6(1oz Base); 10/8(2oz Base) 10/10(3oz Base); 12/12(4oz Base)
	Min Via pad size(single side)			4	3
	Etching logo line width(Min)		mil	8(1/2oz Base); 10(1oz Base); 12(2oz Base)
Laminating	Min dielectric thickness		mm	18um Base)
	Max dielectric thickness(no bare core)		mm	7628+2116+7628=0.185+0. 105+0.185=0.475
	Board thickness tol. (T≤1.0mm)		mm	±0.1
	Board thickness tol.(T>1.0mm)		%	±10(1.0mm<T≤2.4mm),±8(T>2.4mm)
	Twist		%	0.7 (NO SMT board);0.5(SMT board)	0.2
Drilling	Drilling size		mm	0.2-6.3(step:0.05mm)	0.15
	Min drilling size for High frequency board		mm	0.25	0.20
	Min NPTH in first drilling step		mm	0.5	0.2
	Hole wall to conductor space(Min)		mil	8(≤6layer );10(≤14layer)
	Min hole to conductor space for blind/buried board		mil	9(1 time laminating);10(2 or 3times laminating)
	Min. space from two hole wall in the same network		mil	6(after compensation)
	Min space from two hole wall in the diff. network		mil	12(after compensation)
	Space from two NPTH wall(Min)		mil	8
	Hole position tol.		mil	±3
	Press fit hole tol.		mil	±6
	Drilling diameter tol.		mm	0.04
	Drilling slot tol.		mm	±0.15(long side)±0.10(short side)
	Mill cutter diameter		mm	0.60--1.20
	Slot length direction/width direction			1.8?1
	Depth tol. of step hole and countersink		mm	±0.2	±0.10
	Tol. of Step hole and countersink		mm	±0.15	±0.10
	Hole angle tol. of step hole and counter sink		°	±10
PTH	Min. copper thickness in hole		um	20
Solder mask(S/M)	S/M type			Nanya LP-4G
	S/M color			green, yellow, black, white, red, blue
	S/M opening single side(Min)		mil	2
	Min S/M opening width for logo		mil	8
	Min S/M opening single side for NPTH		mil	4
	S/M bridge(Min)		mil	4(green),5(other color)
	S/M hardness		H	6
	S/M thickness(corner of the trace)(Min)		um	10
	S/M thickness over via		um	8-10	15
	S/M over max copper		oz	4
	Plugged via(Max)		mm	≤0.35	0.4-0.8
Silkscreen	Silkscreen color			white, black, yellow, grey
	Silkscreen line Width/Height(18um Base)		mil	4/27
	Silkscreen line Width/Height(35um Base)		mil	5/30
	Silkscreen line Width/Height(70um Base)		mil	6/45
	Min space from silkscreen to pads		mil	6	4
	Min space between carbon ink pad		mil	15	12
	Min space between carbon ink and conductor		mil	10	8
	Carbon ink larger than conductor by min. size		mil	6	4
	Carbon ink sheet resistance		ohm	15
	Peellable mask			SD-2955,SD-2954, HL-808B(QUNQIANG)
Silkscreen	Peelable mask thickness		mm	0.20--0.50
	Peelable mask opening larger than conductor by min size		mil	7	6
	Min space from peelable mask to pad(min)		mil	16	14
	Max plugged via size for peelable mask		mm	5
Gold finger	Ni thickness standard		um	3-5
	Au thickness standard		um	0.8-1.3
	Max finger length(max)		inch	2
	Finger space(min)		mil	7
Immersion gold	Ni thickness standard		um	3-6
Immersion gold	Au thickness standard		um	0.05--0.075	0.05-0.1
Immersion Sn	Sn thickness		mm	0.80-1.20
Immersion Sn	Min board size		mm	50*100
Immersion Ag	Ag thickness		um	0.10-0.30
Immersion Ag	Min board size		mm	60*80
OSP	OSP thickness		um	0.15-0.30
OSP	Min board size		mm	110*110
HASL	Min SMT/BGA pad space		mil	6
	Board thickness(finished)		mm	0.6-3.0	0.5-4.0
	Sn thickness		um	2?40
Lead free HASL	Sn thickness		um	2-40
Routing	Outline tol.		mil	±6	±4
	Milling cutter size(Min)		mm	0.8
	Radius at inner angle(Min)		mm	0.5	0.4
	Chamfer angle for gold finger		°	20---60
	Gold finger chamfer angle tol.		°	±5
	Gold finger chamfer depth tol.		mm	±0.20
	Slot size tol.(milling slot)		mm	±0.15	±0.12
	Second drilling step hole tol.		mil	≥3
	Second drilling step hole location tol.		mil	±5
	V-CUT angle		°	20,30,45,60
	V-CUT angle tol.		°	±5
	V-CUT symmetry tol.		mm	±0.05
	V-CUT web thickness tol.		mm	±0.1
	Min dis. from V-cut central line to conductor (T≤1.0)		mm	0.3(20°),0.33(30°),0.37(45°),0.42(60°)
	Min dis. from V-cut central line to conductor (1.0<=T≤1.6)		mm	0.36(20°),0.4(30°),0.5(45°),0.6(60°)
	Min dis. from V-cut central line to conductor (1.6<=T≤2.4)		mm	0.42(20°),0.51(30°),0.64(45°),0.8(60°)
	Min dis. from V-cut central line to conductor (2.5<=T≤3.2)		mm	0.47(20°),0.59(30°):0.77(45°):0.97(60°)
	Remain thickness tol. of Gold finger after chamfer		mil	±5
	Guide trace for gold finger		mil	20	10
	Bridge+stamp hole standard design			3drill hole in one bridge, hole wall dis. 0.3mm,4 hole wall, hole size0.6-1.0mm,bridge dis.≤3inch
E-test	Space form e-test point to board edge		mm	0.5
	Resistance for Short		ohm	10	7
	Resistance for Opens (min)		ohm	5
	Insulation resistance for Shorts (max)		M ohm	100
	Test voltage		v	200	500
	electric current (max)		mA	200
FQC report and test	COC report			standard
	Impedance control test			standard
	Micro-section test			standard
	Thermal shock test
	Withstanding voltage test
	Ionic contamination test
	Solder ability test
	Insulation resistance test
	Peel-able strength test


You can now get Cutting Edge PCBs for a Fraction of what you usually pay as fast as 24-Hour Turn!

	Cutting Edge Technology Printed Circuit Boards up to 30 layers 2.5-mil traces and 3.5-mil spaces Minimum drill size 8-mil Blind and Buried Via Controlled Impedance High temperature, high frequency material Aluminum and other special materials RoHs Compliant ISO-9001 and UL certified

RIGID BOARDS

Specification 1

Specification 2

Unit

Standard

Special

Inspection standard

Quality Inspection

GB/T 16261-1996, IPC-6012 Class II

IPC-6012 Class 3 GJB362-96

Test method

IPC-TM-650, GB/T4677-2002

Cam department

Accept data

TANGO, PROTEL series, PADS2000, Power PCB, AUTOCAD, PCAD

Cam operation software

Genisis, CAM350, GC-CAM

General capability

Max layer

Layer

Max board size(high frequency /FR4 material)

inch

16x18 / 20x24

22x42

Min board size(not panel)

20*30

Min and Max board thickness

0.3 - 4.0

5.0

Min and Max Board Thickness 2-layer

0.4 - 4.0

0.3 - 5.0

Min and Max Board Thickness 4-layer

0.6 - 4.0

0.45 - 5.0

Min and Max Board Thickness 6-layer

0.8 - 4.0

0.65 - 5.0

Min and Max Board Thickness 8-layer

1.2 - 4.0

1.0 - 5.0

Min and Max Board Thickness 10-layer

1.5 - 4.0

1.2 - 5.0

Min and Max Board Thickness 12-layer

1.6 - 4.0

1.4 - 5.0

Min and Max Board Thickness 14-layer

1.8 - 4.0

1.65 - 5.0

Max Aspect Ratio

10:1 (Related min hole size 0.20mm)

Min drilling size

0.2

Max. Inner layer copper finished (oz)

Max. Outer layer copper finished (oz)

Min BGA pad diameter (No via pad)

mil

Min SMT/BGA space

mil

FR4 core/prepreg thickness

Core thickness
(base copper Hoz/Hoz, 1oz/1oz)

0.08	0.1	0.13	0.15
0.20	0.25	0.36	0.51
0.71	0.80	1.0	1.2
1.5	2.0	2.4	2.5
3.0	3.2

0.05 H/H
base copper:
18/35
35/70
70/105

Prepreg thickness

7628=0.185, 2116=0.105, 3313=0.095, 1080=0.075

mil

3.15	3.94	5.12	5.91
7.87	9.84	14.17	20.08
27.95	31.50	39.37	47.24
59.06	78.74	94.49	98.43
118.1	125.9

mil

7628=7.28, 2116=4.13, 3313=3.74, 1080=2.95

Special Material

Rogers

Ro4350, Ro4350B, Ro4003, Ro4003C, Prepreg:RO4403 (4mil), RO4350(4mil)

Arlon

AD350, AR1000, 25FR, 33N, Diclad527, 85N, etc

Isola

370HR

Halogen-Free (Tg=130)

Shengyi core: S1155, PP: S0155

Halogen-Free (TG=170)

Shengyi core: S1165, PP: S0165

High TG

Shengyi core : S1170 pp: S070

Surface Treatment

Surface

HAL, HAL Lead free, Immersion gold, immersion Sn, Immersion silver, OSP, Carbon ink, Flash gold

Gold finger

Hard gold, flash gold

Impedance Control

Material

FR-4, Rogers, Arlon?Taconic

Tolerance

±10

±5

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Quick Overview

Process Capability

RIGID BOARDS