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The Gold-Place™ MPP-11 pick & place machine component placement is accomplished by the operator manually moving the pick & place head over the component, picking up the component with vacuum pick up tool, moving to the component placement postion, aligning the component and placing the component on the circuit boards.
The digitally timed dispenser accurately deposits solder paste, adhesives and various potting compounds.
Key features:
Includes both the pick & place and 4 mode dispenser functions
Work area handles board sizes up to 14” x 14”
A left/right handed pick & place head
Movable padded hand rest design to alleviate operator fatigue and discomfort
AutoPick™ feature allows easy pick-up of parts such as melfs and small components from tape
Optional tape feeders with feeder rack for more efficient component handling which can be added at any time
Equipped with 40 movable ESD safe component bins (32 - 1" x 1" and 8 - 2" x 2", reconfigurable) which slide in close to placement area
Economical manual benchtop pick & place system
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