This paste is a high quality, low cost prototyping solder paste. Since it's premixed, all you need to do is, cut off the tip, squeeze the paste onto your solder pads and heat it up using a solder gun, heat gun, hot plate or any other suitable heat source. It's simple, convenient and best of all, it's made in the USA!
The NC676, manufactured by FCT SOLDER, is a new generation halide-free, rosin-based chemistry designed to provide a previously unseen level of repeatability and consistency to the printing process. Ideal for leaded printed circuit board assembly. * Alloy Sn63/Pb37 MP=183°C * Stencil life > 8 hours * Extensive Tack Time * Halogen and Halide Free * Speed 25 to 150 mm/sec. * Clear Residue
The WS159, manufactured by FCT SOLDER, is designed to provide humidity tolerance and excellent wetting to meet the requirements for reliable solder joints in printed circuit board assemblies. * Alloy Sn63/Pb37 * Stencil life > 6 hours * Good Activity * Cleans Easily * Speed: 25 to 150 mm/sec. * Shiny Solder Joints
The NL932, manufactured by FCT SOLDER, delivers Surface Area Ratio (SAR) paste transfer efficiencies below 0.6 and 0.55 respectively. NL932 is formulated to deliver exceptional cosmetics, especially when used in conjunction with Nihon Superior’s SN100C patented lead free alloy. It was specially designed to meet the requirements for reliable solder joints in printed circuit board assemblies. * Alloys SAC305 & SN100C * Stencil life > 8 hours * Extensive Tack Time * Halogen and Halide Free * Speed 25 to 150 mm/sec. * Clear Residue
The WS888, manufactured by FCT SOLDER, displays previously unseen levels of repeatability and consistency even in a wide range of temperatures (65°-85°F) and relative humidity (25% - 65% RH). Commonly used in printed circuit board assembly. * Alloys SAC305 & SN100C * Stencil life > 8 hours * Acceptable Activity * Cleans Easily * Speed 25 to 150 mm/sec. * Low Voiding
Manufactured by AMTECH, the SynTECH-N solder paste was designed for stencil printing. SynTECH will give you long stencil life, wide reflow window, good wetting compatibility and clear residue. Designed for the stencil printing process, one of the most important parts in the printed circuit board assembly process. * Low voiding * Synthetic materials * Stencil life > 10 hours * Wide reflow window * Excellent wettabilitty compatibility * Compatible with enclosed printing heads
NC-560-LF is a lead-free, no-clean, halide-free solder paste that delivers improved solderability with all Pb-Free metallization, including ENIG (Gold), OSP, HASL and immersion silver printed circuit boards. This solder paste is also low beading, low voiding, and anti-tombstoning to reduce scrap and rework. * Exceptional print definition * Long stencil life > 8 hours * Excellent wetting compatibility * Wide process window * Low voiding * Clear residue
The 4300 series offers true multi-process capabilities, ideal for water washable applications, able to be cleaned using standard aqueous cleaning systems without saponification. Utilizes synthetic materials that deliver ideal printing characteristics, unparalleled lot-to-lot consistency and extremely long stencil life. LF-4300 is also VOC and halide-free, and classified as RELO. * Synthetic materials * Can reflow high temperature alloys up to 300°C * Complieswith RoHS directive 2002/95/EC * Wide reflow window * Excellent wettabilitty compatibility * Low voiding and mid-chip beading