If you are looking to reball 15 or more devices, the EZReball™ system is a convenient and easy to use reballing preform that will accurately place solder spheres on CSPs and BGAs. Each of our EZReball™ performs are custom manufactured to your component requirements.
The RB2000 BGA Reballing Kit features durable stencils and holders to manually rework BGA components to original condition. With this BGA Rework tool you can reball costly BGA's using your hot air rework stations or other reflow equipment. The kit is the perfect solution for low volume BGA reballing, the kit contains the items needed to get started immediately, Ideally suited for labs and printed circuit board prototyping.
The BGA Reballer is delivered in a kit that is simple to use, cost effective and, best of all, reusable. It comes with necessary materials including replacement spheres/balls for the specific package. The BGA Reballer allows the recovery of a good component by replacing the attachment solder balls with new ones. This allows the original component to be saved and the savings can be enormous, Ideally suited for printed circuit board prototyping