This W2 is an automatic lead-free wave soldering device that is totally equipped with flux spraying system, touch screen and PLC control system, finger cleaning system, titanium solder pot, one preheating zone, for PCBs with a maximum size of 350mm, high automation, reliability and performance.
The entire machine assumes industrial personal computers as its core controller, automatically controlled instrument to bring you high automation, reliability and performance. internationally advanced wave-soldering processes and technologies, thus achieving a high-quality soldering.
Spray System | |
Transmission Method | Step motor |
Spray Pressure | 0.25Mpa--0.4Mpa |
Flux flow | 10-100ml/min |
Exhaust Diameter | Φ200mm |
Exhaust Capacity | 25m3/min |
Preheating System | |
Preheating Mode | Hot air |
Control Mode | PID + SSR |
Preheating Zone | 1 |
Preheating Length | 900 mm |
Preheating Temp | (Room Temperature)-250℃ |
Warm-up Time(min) | Approx.15min (setting 150℃) |
Conveyor System | |
PCB Width | 60~350mm |
Conveyor Speed | 0-2000(mm/min) |
Conveyor Height | 750+/-20 (mm) |
Finger | Standard with double hook claw |
Conveyor width control | Manually |
Conveyor Angle | 4~7degree |
Soldering System | |
Solder Pot style | Mechanical Motor drive |
Solder Pot Material | Full Titanium |
solder pot temperature | 300℃ |
solder pot capacity | Lead-free 250kg |
Nitrogen System Option | |
Consumption | 12m³/H 1000PPM |
Pressure | 0.5-*0.8MPa |
Flowmeter | 3 |
N2 Sources | ≤10PPM |
Finger cleaning system | |
Cleaning system | Brush |