SAC305 Indium3.2 Pb-Free Water-Soluble Solder Paste

SAC305 Indium3.2 Pb-Free Water-Soluble Solder Paste

Data Sheet
Indium3.2 is an air or nitrogen reflow, water-soluble solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, SnSb, and other Pb-free alloy systems. This product formulation offers consistent, repeatable printing performance combined with a long stencil life and sufficient tack strength to handle the challenges of today’s high-speed as well as high-mix surface mount lines. In addition to consistent printing and reflow requirements, this solder paste offers superb wetting to the various Pb-free metallizations and has exceptional low-voiding performance on fine-pitch components, including BGAs and CSPs.
Packaging
Pricing Information
QTY:
Unit Price:
$115.00
Total: $115.00

Main Features

SAC305
  • Consistent fine-pitch printing performance with high transfer efficiency from stencil apertures
  • Superior fine-pitch soldering ability
  • Wide reflow profile window
  • Excellent response-to-pause printing performance
  • Outstanding slump resistance
  • Low-voiding
  • Minimal foaming during the cleaning process
  • Excellent wetting

Alloys

Indium Corporation manufactures low-oxide spherical powder composed of a variety of Pb-Free alloys that cover a broad range of melting temperatures. Type 3 powder is the standard offering with SnAgCu, SnAg, and SnSb Pb-free alloy systems. The metal percent is the weight percent of the solder powder in the solder paste and is dependent upon the powder type and application.

Storage and Handling Procedures

Refrigerated storage will prolong the shelf life of solder paste. The shelf life of Indium3.2 is no less than 4 months when stored at <5°. Solder paste packaged in cartridges and syringes should be stored tip down.

When refrigerated, solder paste should be allowed to reach ambient working temperatures prior to use. Generally, paste should be removed from refrigeration at least 2 hours before use. Actual time to reach thermal equilibrium will vary with the container size, and the solder paste temperature should be verified before use. Jars and cartridges should be labeled with the date and time of opening. It is not recommended to remove worked paste from the stencil and mix it with the unused paste in the jar because this may alter the rheology of the unused paste.

Printing

Stencil Design:

Electroformed and laser cut/electropolished stencils produce the best printing characteristics among stencil types. Stencil aperture design is a crucial step in optimizing the print process. The following are a few general recommendations:

  • Discrete components—A 10–20% reduction of stencil aperture has significantly reduced or eliminated the occurrence of mid-chip solder beads. The “home plate” design is a common method for achieving this reduction.
  • Fine-pitch components—A surface area reduction is recommended for apertures of 20mil pitch and finer. This reduction will help minimize solder balling and bridging that can lead to electrical shorts. The amount of reduction necessary is process-dependent (5–15% is common).
  • For optimum transfer efficiency and release of the solder paste from the stencil apertures, industry standard aperture and aspect ratios should be adhered to.

Recommended Printer Operation

Solder Paste Bead Size 20–40mm in diameter
Print Speed 150mm/second
Squeegee Pressure 0.018–0.027kg/mm of blade length
Underside Stencil Wipe Start at once per every 5 prints and decrease frequency until optimum value is determined
Solder Paste Stencil Life >12 hours (<60% RH and 22–28°C)
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