Flip-up stencils are small solder paste stencils typically used to print a single component a printed circuit board. They were designed to be used with the MSP 100/300/400 and SH-1 printers though they can be used manually. They come with a holder and a squeegee blade. A flip-up stencil is a great tool for PCB rework and printed circuit board assembly.
Flip-up Stencils are custom made for any component and can be customized with relief areas, to eliminate removing neighboring components. They have the same footprint and aperture sizes used in a regular production stencil. They can be made in BGA, QFP, PLCC, SOIC, and connector patterns.
|Technology used to make the stencils||Laser cut or chem etch|
|Material used||Stainless Steel|
|Stencil thickness||.004 - .008 inches|
|Minimum cut size||.002 inches|
|Aperture tolerance||within .00025 inches|
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