AQ-260 Offline PCBA Cleaner

AQ-260 Offline PCBA Cleaner

Part Number: AQ-260 Product Brochure

This system is designed for cleaning PCBA in the electronics manufacturing industry, the machine integrates four key modules: cleaning, rinsing, drying, and a filtration module. It uses the industry's most advanced water-based cleaning process.
Pricing Information
QTY:

Unit Price:
$15,950.00
Shipping Price:
$1,700.00

Total: $17,650.00

Product Accessories for AQ-260 Offline PCBA Cleaner


Main Features

Quick change spring
loaded double sided printed circuit board nesting kit
  • SMTrue Vision Assist 10X magnification, axial alignment of stencil to board, single or dual camera, software, communication cabling, and computer.
  • Pneumatic adjustable power sweep squeegee for printing with single or dual stroke
  • Power frame lift for higher volume production
  • Fine X, Y, and Theta adjustments for exact, repeatable stencil to board print alignment
  • Single Z-axis self leveling adjustment
  • Quick change spring loaded double sided printed circuit board nesting kit
  • PCB vacuum hold down (optional)
  • Adjustable frame holder compatible with all tubular or cast 23” x 23” framed stencils
  • Adjustable, reproducible angle-of-attack squeegee adjustments
  • Dual squeegee holder (urethane or metal) with independent print force adjustment for clean, convenient applications of solder paste

System Features

  • Transparent Cleaning Process: The cleaning chamber is equipped with a visual window, allowing the entire cleaning process to be clearly observed.
  • Spacious Cleaning Area: Dimensions: 450 (W) × 450 (D) × 230 mm (H), providing ample space for efficient cleaning.
  • Scientific Nozzle Design: Nozzles are progressively arranged from left to right to enhance cleaning efficiency, while vertical distribution ensures complete coverage, eliminating blind spots.
  • Adjustable Nozzle Pressure: The pressure-adjustable nozzle system prevents issues like splashing and collision damage when cleaning small-sized PCBAs under high pressure.
  • Standardized Chemical Liquid Heating System: Equipped with a built-in heating system to significantly improve cleaning efficiency and reduce processing time.
  • User-Friendly Touchscreen Interface: Allows customization of process parameters (e.g., chemical temperature, cleaning time, rinse cycles/duration, drying time) for different PCBA models. Multiple programs can be stored for quick access.
  • High-Purity Cleaning Standards: Meets IPC-610D Class 1 (≤1.5 μg/cm² ion contamination) and MIL-STD-28809 Class 1 standards, ensuring military-grade cleanliness.
  • Convenient Chemical Refill System: Supports manual addition of cleaning chemicals for flexible operation.
  • Comprehensive Cleaning Performance: Effectively removes both organic and inorganic residues from product surfaces.
  • Fully Automated Cleaning Cycle: Completes cleaning, rinsing, and drying in a sealed chamber, featuring a compact and space-saving design.

Components

This system enables efficient cleaning of a wide range of PCBAs and electronic assemblies, removing both organic and inorganic residues even in high-density areas, under-component spaces, and fine-pitch regions, while maintaining a safe process for small and delicate boards.

Vision System

User-Friendly Touchscreen Interface: Allows customization of process parameters (e.g., chemical temperature, cleaning time, rinse cycles/duration, drying time) for different PCBA models. Multiple programs can be stored for quick access.

Feeders

User-Friendly Touchscreen Interface: Allows customization of process parameters (e.g., chemical temperature, cleaning time, rinse cycles/duration, drying time) for different PCBA models. Multiple programs can be stored for quick access.

Adjustable Nozzle Pressure: The pressure-adjustable nozzle system prevents issues like splashing and collision damage when cleaning small-sized PCBAs under high pressure.

Spacious Cleaning Area: Dimensions: 450 (W) × 450 (D) × 230 mm (H), providing ample space for efficient cleaning.

Comprehensive Cleaning Performance: Effectively removes both organic and inorganic residues from product surfaces.

Fluid Dispenser

Fully Automated Cleaning Cycle: Completes cleaning, rinsing, and drying in a sealed chamber, featuring a compact and space-saving design.


High-Purity Cleaning Standards: Meets IPC-610D Class 1 (≤1.5 μg/cm² ion contamination) and MIL-STD-28809 Class 1 standards.

Standard Features

  • Transparent cleaning chamber with visual window for full process visibility.
  • Spacious cleaning area: 450 (W) × 450 (D) × 230 mm (H).
  • Scientific nozzle design with progressive and vertical distribution to eliminate blind spots.
  • Pressure-adjustable nozzle system to prevent splashing and collision damage on small-sized PCBAs.
  • Fully automated cleaning cycle (cleaning, rinsing, drying) in a sealed compact chamber.

specs

Clean Basket Size Max 460mm(L) × 460mm(W); 1 layer
Handle Max PCBA Size Max 450(L) × 230mm(W)
The Max component height on the PCBA Max 35mm
Min Product Size Min 20mm(L) × 20mm(W), the small product need customized fixture to fix it.
Chemical Liquid Tank Capacity 51L
Spray Tank Capacity 25L
Cleaning method 360° Rotate/Ejection for cleaning; cold air for
Cleaning time drying
Rinsing Time 5~20 Minutes (Reference)
Rinsing Times 1-2 Minutes (Reference)
1-10 (Set)
Drying Time 20~30 Minutes (Reference)
Cleaning Liquid Recovery Filter 0.45um (filter tiny impurities: solder paste, flux, rosin and pollutants)
Dilution Liquid Heating Temperature Room temperature~75°
Need DI Water Supply 30~60L/min
Need DI Water Pressure 0.2-0.4Mpa
Need DI Water Entrance Pipe Connection 1 inch
Chemical Liquid Heating Power 3KW
Cleaning Motor 0.75KW
Total Power 4.5KW
Total Current (Max) 21A
Air consumption 200-400L/Min
Air Supply 0.45Mpa~0.7Mpa
Power Supply 1Phase 220V 50/60HZ
Net Weight Approx 200Kg
Machine Size W698*D748*H1160mm
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