Frameless Electroformed Stencils

Electroformed Frameless Stencils are nickel-based, electroform foils designed to work with stencil tensioning systems also known as _Reusable Stencil Frames_. They do not need to be permanently glued in a frame. Electroformed stencils offer the best paste release characteristics available and are frequently used for fine pitch (20 mil to 12 mil pitch) SMT applications on prototype printed circuit boards. They are also used for µBGA's, Flip Chip, and Wafer Bumping (12 mil to 6 mil pitch).

leadtime icon Lead Time: 48-Hour Turn
dollar icon $425.00
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Framed Electroformed Stencils

Electroformed stencils offer the best paste release characteristics available and are frequently used for fine pitch (20 mil to 12 mil pitch) SMT applications on printed circuit boards. They are also used for µBGA's, Flip Chip, and Wafer Bumping (12 mil to 6 mil pitch). * The smooth trapezoidal sidewalls of an electroformed stencil allow for better paste release * Nickel has a lower coefficient of friction compared to stainless steel * Electroform foils are harder than full hard stainless steel of comparable thickness, providing for longer stencil life

leadtime icon Lead Time: 48-Hour Turn
dollar icon $475.00
Learn more