The BGA1600C Repair workstation is a new product for the BGA chip repairing market. It deals with BGA, CSP, LGA (Land Grid Array), Micro SMD, MLF (Micro-Lead Frame), BCC (Bumped Chip Component) and assemble rework system for super dense foot chip. It is convenient and stable for all kinds of PCB, especially for large size PCBs.

• Adopts best heating material to control disassemble and weld for BGA.
• Hot air and temperature can be adjusted, and the generated high temperatures rotates air.
• Moving heating head, easy operation.
• There are two independent heating zones one in the top and one in the bottom. The first heating zone can control temperatures, and the second heating zone can take PCBs heat to get the best welding effect.
• There are different temperature profiles in the top and bottom. A Large powered motor fan can cool rapidly PCBs to perfection.
• The max PCB is 17.71" x 15.74" or 450mm x 400mm
• Capable of adjusting PCB's frames with anti-scald protection design.
• Support frame in the BGA welding district, adjust support height to avoid going down from the welding district.
• 20 segments warm-up control, it can save 2 groups setting temperature profiles.
• Adopt import high precision thermocouple to achieve inspect temperature minutely.
• With an alarm and reminder functions after disassembly and weld. The circuit can cut off when short circuit, and with super temperature protection function.
• With computer communication function, PC serial port inside, temperature interface outside, with a software to achieve computer control.
• Hot air nozzle with different sizes. It is easy to replace.
• Hand vacuum absorb pen to absorb BGA, the suction can be adjusted.
• With head lamp to increase ray in the working district.
• It is suitable for lead and lead free welding.