NC165 No Clean Flux

NC165 No Clean Flux

Part Number: NC165 No Clean Flux Clock fast Lead Time: 4 Days Pdf file Data Sheet

NC165 NO CLEAN FLUX is a halide-free, no clean activated material formulated to work with Printed Circuit Board Assembly’s SN100C Bar Solder and standard Sn/Pb Alloys. NC165 eliminates solder balls while providing excellent solderability with minimal flux residue.

  • A solder temperature of 250-260 degrees C should be maintained
  • Excellent Solderability
  • Available in 1 Gallon Container
Pricing Information

Unit Price:

Total: $110.00

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NC165 has slightly lower solids content than NC160 for applications where less flux residue is desired.

Material Safety Data Sheets (MSDS)

NC1165 No Clean Flux MSDS

Main Features

Specific gravity
should be maintained
between 0.80 and 0.84.
  • Amount of flux applied during foaming applications should be between 800 and 1300 micrograms per square inch of circuit.
  • Amount of flux to be applied during spray should be between 475 and 850 micrograms per square inch of circuit


Solids Content 3.4-3.8%
Specific Gravity at 20 Degrees C 0.80 – 0.84
Acid Number (mgKOH/gm) 22 - 26
Color Clear to light amber
Copper Mirror Low Activity
J-STD-004 Classification ROL0
Halides Content 0.00%