NC-560-LF is a lead-free, no-clean, halide-free solder paste that delivers improved solderability with all Pb-Free metallization, including ENIG (Gold), OSP, HASL and immersion silver printed circuit boards. NC-560-LF is RoHS-compliant and increases production yields with its unparalleled lot-to-lot and stencil printing consistency, and offers superior print performance characteristics, including excellent wetting, strong activity, ideal viscosity, long stencil life, thermal stability up to 300°C, and minimal residue. NC-560-LF is also low beading, low voiding, and anti-tombstoning to reduce scrap and rework.
Material Safety Data Sheets (MSDS)NC-560-LF MSDS
The print definition of NC-560-LF is ideal for fine pitch applications. The stencil life of this no-clean product virtually eliminates waste of solder paste. This type 3 solder paste will meet pitch requirements from 16 mil to 24 mil.
The following are general guidelines for stencil printer optimization with NC-560-LF. Some adjustments may be necessary based on your process requirements:
Automated stencil cleaning systems for both stencil and misprinted printed circuit boards. Manual cleaning using 99% isopropyl alcohol (IPA) works well.
Read the data sheet to find specifications about the recommended temperature profile.