Whenever a BGA component is removed from an assembly, the attachment balls must be replaced before it can be reused. It's frustrating and very costly to throw away good components that could be recovered with the right tools. What about the delay looking and waiting for a new component to arrive?
The BGA Reballer allows the recovery of a good component by replacing the attachment solder balls with new ones. This allows the original component to be saved and the cost savings can be enormous.
Not just for the cost of the component itself but cost of production delays, shipping, purchasing, etc…. What if the component is a limited production run and a replacement isn't even available? We can't afford this kind of waste in today's production environment.
BGA Reballers are constructed of material that allows them to be used over and over without loss of accuracy. They're stocked for most common BGA package types, but there are many variations of component features and some of these are quite unique.
We can easily create a BGA Reballer to accommodate your needs. Just send a drawing and we'll make one to fit your specific component - even custom patterns. Reballers can be used to recover Chip Scale and FBGA, even very large ceramic BGAs. Anything with ball attachments can be recovered.