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Zelplace BGA
Part #: Zelplace BGA
Lead Time: 4-6 Weeks
Quick Overview
ZelPlace BGA - perfect handling for the new generation of components. Assembly of highly integrated printed circuit boards is possible.
The placement of components with hidden connections requires a reliable and precise adjustment because of expensive inspection systems and difficult repair possibilities. The BGA Placer is appropriate for the accurate placement of different types of BGA, CSP and Flip chip components, as well as for fine pitch and ultra-fine pitch of components.
The system is suitable both for the development lab and for the volume production of printed circuits
Zelplace BGA
ZelPlace BGA - perfect handling for the new generation of components. Assembly of highly integrated printed circuit boards is possible.
The placement of components with hidden connections requires a reliable and precise adjustment because of expensive inspection systems and difficult repair possibilities. The BGA Placer is appropriate for the accurate placement of different types of BGA, CSP and Flip chip components, as well as for fine pitch and ultra-fine pitch of components.
The system is suitable both for the development lab and for the volume production of printed circuits
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| Maximum circuit board size |
1.8“ x 1.8“ (45 mm x 45 mm) |
| Min. size of components |
0.2“ x 0.2“ (5 mm x 5 mm) |
| Pitch |
12 mil (0.3 mm) |
| Placement accuracy |
±2 mil (±50 ?m) |
| Power supply |
230 V/50 Hz oder 115 V/60 Hz, 20 VA |
| Compressed air |
6 bar (87 psi), min. 5 l/min (0.18 cfm), oil-free |
| Dimensions (W/H/D) |
23.6“ x 17“ x 17.1“ (600 mm x 430 mm x 435 mm) |
| Weight |
35 kg (77 lb) |
ZelPlace BGA - perfect handling for the new generation of components. Assembly of highly integrated printed circuit boards is possible.
The placement of components with hidden connections requires a reliable and precise adjustment because of expensive inspection systems and difficult repair possibilities. The BGA Placer is appropriate for the accurate placement of different types of BGA, CSP and Flip chip components, as well as for fine pitch and ultra-fine pitch of components.
The system is suitable both for the development lab and for the volume production of printed circuits.
- Product characteristics
- Placement of BGA and QFP components from 5 mm x 5 mm to 45 mm x 45 mm
- Granite base
- Air-bearing positioning table
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