WS488 Water Soluble Solder Paste (Leaded or Lead Free)

WS488 Water Soluble Solder Paste (Leaded or Lead Free)

Part #: WS488
Lead Time: Syringe and Jar In Stock
AIM’s WS488 water soluble paste has been designed to wet virtually any solderable electronic surfaces, components, assemblies, and substrates. WS488 is compatible with all leaded and lead-free alloys, and has been developed for use in a wide range of applications.
  • Alloy Sn63/Pb37 MP=183°C
  • Large Process Window
  • Excellent Wetting
  • Alloy SAC305 MP=217°C (Lead Free)
  • Stencil Life > 8 Hours
  • T4 in stock and ready to ship
Features
  • Excellent Wetting
  • Superior Slump Resistance
  • Aqueous Wash with Water
  • Extended Cleaning Window
  • 8 Hour + Stencil Life
  • Large Process Window

Product Description
AIM’s WS488 water soluble solder paste has been designed to wet virtually any solderable electronic surfaces, components, assemblies, and substrates. WS488 offers superior slump resistance, as well as excellent print characteristics and 8+ hours of stencil life. WS488 is compatible with all leaded and lead-free alloys, and has been developed for use in a wide range of applications. Easily cleaned in tap water, this all purpose water soluble product was created to meet the industry’s demand for a consistently reliable water soluble product.

WS488 SN62/SN63 Datasheet
WS488 SAC305 Datasheet
Material Safety Data Sheets (MSDS)
WS488 SN62/SN63 MSDS
WS488 SAC305 MSDS

Printing
  • Apply sufficient paste to the stencil to allow a smooth, even roll during the print cycle (a bead diameter of 12 to 16 mm (˝ to ⅝ inch) is normally sufficient to begin).
  • Apply small amounts of fresh solder paste to the stencil at controlled intervals to maintain paste chemistry and workable properties.
  • WS488 provides the necessary tack time and force for today’s high speed placement equipment, which will enhance product performance and reliability.

Cleaning
WS488 can be cleaned easily with water. Deionized water is recommended for the final rinse. A temperature of 38°C (100°F) - 66°C (150°F) is sufficient for removing residues. An in-line or other pressurized spray cleaning system is suggested, but is not required.

Reflow Profile
Please refer to datasheets.


Handling and Storage
  • WS488 has a refrigerated shelf life of 6 months at 4°C (40°F) - 12°C (55°F).
  • Allow the solder paste to warm naturally to ambient temperature (8 hrs.) prior to breaking the seal for use.
  • Mix the product lightly and thoroughly for 1 to 2 minutes to ensure even distribution of any separated material.
  • Do not store new and used paste in the same container, and reseal any opened containers while not in use.
  • Replace the internal plug and cap of the 500 gram jars to ensure the best possible seal.

Safety
  • Use with adequate ventilation and proper personal protective equipment.
  • Refer to the accompanying Material Safety Data Sheet for any specific emergency information.
  • Do not dispose of any lead-containing materials in non-approved containers.

Physical Properties
ITEM SPECIFICATION
Alloy Sn62 and Sn63 SAC305
Appearance Gray, Smooth, Creamy
Melting Point 183° C 217° C
Particle Size T3, T4, T5
Metal Loading 89.5% (T3) 88.5% (T3)
Viscosity Print/Dispense
Packaging Available in all industry standard packaging.

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PRODUCT PRICING
Price:  $20.00

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