Spartan 8 Single and Dual Wave Solder Machines

Spartan 8 Single and Dual Wave Solder Machines

Part #: WSM-8
Lead Time: 10 weeks
Data Sheet: Download PDF File
Automatic wave solder system with proven performance, self-contained fluxing, preheating and laminar (smooth) solder wave modules. Decrease labor costs by significantly reducing hand soldering.
The Spartan 8S (Single wave) and 8D (dual wave) solder machines can process printed circuit board assemblies up to 8 x 11.4 wide and require very little solder for their size. The single or dual wave systems come complete with Conveyor, Foam Fluxer with Integral Air Compressor, Preheaters, and Stainless Steel Solder Pot with drain valve, and compact microprocessor Controller, automatic Wave Soldering Systems.
Model 8S (single wave) 8D (dual wave)
Power 220 VAC, 60 Hz
1, 30A
220 VAC, 60 Hz
1, 40A
Foam Fluxer Tank 0.5 gal/2 ltrs 0.5 gal/2 ltrs
Solder pot capacity 125 lbs/57 kgs 300 lbs/136 kgs
Max Wave Height 0-3/8/0-10mm 0-3/8/0-10mm
Wave Width 8.0/203mm 8.0/203mm
Max Preheat 1 Temp 338F/170C 338F/170C
Max Preheat 2 Temp 428F/220C 428F/220C
Preheat 1 Power 2.25 kW 2.25 kW
Preheat 2 Power 1.5 kW 1.5 kW
Max Solder Pot Temp 575F/300C 575F/300C
Lead Free Pot Temp 662F/350C 662F/350C
Solder Pot Power 2.5 kW 3.2 kW
Approx. Warm-up time 40 min. 40 min.
Max Conveyor Speed 6 ft/min
(2 m/min.)
6 ft/min
(2 m/min.)
Pallets STD: 8 x 11.4
200 x 290 mm
STD: 8 x 11.4
200 x 290 mm
Overall L. (in/mm) 96.5/2451 96.5/2451
Footprint Length 66.5/1690 66.5/1690
Width (in/mm) 31/787.4 31/787.4
Height (in/mm) 20/508.0 20/508.0
Venting Requirement 300 CFM/500 m3/h max., 4/100 mm Dia. Flange
Automatic wave solder system with proven performance, self-contained fluxing, preheating and laminar (smooth) solder wave modules. Decrease labor costs by significantly reducing hand soldering.
The Spartan 8S (Single wave) and 8D (dual wave) solder machines can process printed circuit board assemblies up to 8 x 11.4 wide and require very little solder for their size. The single or dual wave systems come complete with Conveyor, Foam Fluxer with Integral Air Compressor, Preheaters, and Stainless Steel Solder Pot with drain valve, and compact microprocessor Controller, automatic Wave Soldering Systems.

When turned on, flux foam is dispensed through flux nozzle to coat bottom of PCBs. The pallet, containing PCBs, passes over flux foam and flux is applied to the joints to be soldered.After PCBs have been fluxed, the PCB passes over preheat 1 and preheat 2. Heat radiated from the preheater dries and activates the flux by elevating the temperature of the PCB.The preheated PCB now moves towards the solder pot. A wave of clean solder is pumped through the nozzle. The PCB passes over this wave of molten solder and all joints are soldered. Include two wave nozzles, laminar and turbulent, for SMT components. The maximum board width is 8 x 11.4 in. 200 mm x 290 mm.

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