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 Solder Paste
NC648 30 Gram Syringe
NC648 30 Gram Syringe
The NC648 no-clean solder paste (Sn63 Pb37) is a modified rosin based paste, which allows a previously unseen level of repeatablity and consistency. This paste offers excellent open time, extended abandon time and good soldering activity and leaves a very clear, colorless post soldering residue.
 
Lead Time: In stock and ready for shipment Price: $16.00
   
WS150 30 Gram Syringe
WS150 30 Gram Syringe
The WS150 water soluble solder paste is designed to meet the requirements for reliable solder joints in PCB board assemblies. It displays previously unseen level of repeatability and consistency. WS150 is halide-free, has a neutral pH and extended tack and stencil life. Residues can be cleaned using warm water with reduced foaming characteristics.
 
Lead Time: In stock and ready for shipment Price: $16.00
   
NC650 250 Gram Jar
NC650 250 Gram Jar
The NC650 no-clean solder paste (Sn63 Pb37) is a modified rosin based paste, which allows a previously unseen level of repeatability and consistency. This paste offers an excellent open time, extended abandon time and good soldering activity with pin probable post soldering residues.
 
Lead Time: In stock and ready for shipment Price: $25.00
   
WS150 250 Gram Jar
WS150 250 Gram Jar
The WS150 water soluble solder paste is designed to meet the requirements for reliable solder joints in PCB board assemblies. It displays previously unseen level of repeatability and consistency. WS150 is halide-free, has a neutral pH and extended tack and stencil life. Residues can be cleaned using warm water with reduced foaming characteristics.
 
Lead Time: In stock and ready for shipment Price: $25.00
   
SN100C NL900 30 Gram Syringe
SN100C NL900 30 Gram Syringe
The SN100C NL900 lead-free solder paste is a modified rosin based no-clean paste, which allows a previously unseen level of repeatability and consistency. SN100C NL900 is the patented Nihon Superior nickel stabilized tin/copper eutectic alloy that has a melting point of 227°C.
 
Lead Time: 5 days Price: $26.00
   
SAC305 NL900 30 Gram Syringe
SAC305 NL900 30 Gram Syringe
The SAC305 NL900 lead-free solder paste is a modified rosin based no-clean paste, which allows a previously unseen level of repeatability and consistency. This paste offers an excellent open time, extended abandon time and good soldering activity with pin probable post soldering residues.
 
Lead Time: In stock and ready for shipment Price: $26.00
   
SAC305 WS157 30 Gram Syringe
SAC305 WS157 30 Gram Syringe
The SN97C (Sn/3.0Ag/0.5Cu) WS157 is a water soluble paste specifically designed for lead free solder processes. It displays previously unseen level of repeatability and consistency. This lead free solder paste offers an excellent open time, extended abandon time and good soldering activity at the elevated processing temperatures required for lead free alloys.
 
Lead Time: In stock and ready for shipment Price: $26.00
   
SN100C WS157 30 g Syringe
SN100C WS157 30 g Syringe
The SN100C WS157 water soluble paste is specifically designed for lead free solder processes. It displays previously unseen level of repeatability and consistency. This lead free solder paste offers an excellent open time, extended abandon time and good soldering activity at the elevated processing temperatures required for lead free alloys.
 
Lead Time: 5 days Price: $26.00
   
SN100C NL900 250 Gram Jar
SN100C NL900 250 Gram Jar
The SN100C NL900 no-clean paste is a modified rosin based lead-free solder paste, which allows a previously unseen level of repeatability and consistency. SN100C NL900 is the patented Nihon Superior nickel stabilized tin/copper eutectic alloy that has a melting point of 227°C.
 
Lead Time: In stock and ready for shipment Price: $45.00
   
SAC305 NL900 250 Gram Jar
SAC305 NL900 250 Gram Jar
The SAC305 NL900 no-clean paste is a modified rosin based lead-free solder paste, which allows a previously unseen level of repeatability and consistency. This paste offers an excellent open time, extended abandon time and good soldering activity with pin probable post soldering residues.
 
Lead Time: In stock and ready for shipment Price: $45.00
   
SAC305 WS157 250 Gram Jar
SAC305 WS157 250 Gram Jar
The SAC305 WS157 water soluble paste (Sn/3.0Ag/0.5Cu) is specifically designed for lead free solder processes. It displays previously unseen level of repeatability and consistency. This lead free solder paste offers an excellent open time, extended abandon time and good soldering activity at the elevated processing temperatures required for lead free alloys.
 
Lead Time: In stock and ready for shipment Price: $45.00
   
SN100C WS157 250 Gram Jar
SN100C WS157 250 Gram Jar
The SN100C WS157 water soluble paste is specifically designed for lead free solder processes. It displays previously unseen level of repeatability and consistency. This lead free solder paste offers an excellent open time, extended abandon time and good soldering activity at the elevated processing temperatures required for lead free alloys.
 
Lead Time: 5 days Price: $45.00
   

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