GF-SL-HT Hot Plates Lead-free and lead soldering, single function hot plate with programmable digital temperature control and 13" x 13" (330mm x330mm) heating area.

GF-DL-HT Dual Hot Plate is used for a variety of heating applications which include preheat, rework, reflow and curing of printed circuit board assemblies.The GF-DL-HT is capable of lead and lead free, high temperature applications and has dual programmable, two digital temperature controllers for precise temperature regulation.

GF-C2-HT Dual function as a hot plate (Conduction) or as a forced air convection reflow oven, ideal for lead or lead-free batch and SMT prototype circuit board assembly, curing and hot plate applications. With its heavy duty construction and stainless steel chamber, the oven is designed for many years of reliable service.

HA06 lead free SMT batch Reflow / quartz Oven system includes the option for nitrogen (N2) inlet that will allow you to process printed circuit boards in oxygen free ambiance, Nitrogen environment allows reduction of peak temperatures therefore nitrogen improves paste spread, increases wet ability, and produces shinier, more aesthetically pleasing solder joints.
This oven is perfect for your challenging lead free prototype PCB assembly projects. An energy efficient mixture of quartz infrared and hot-air convection, two heating zones with temperature control provides accurate heating at the higher temperatures required for lead-free soldering, 12" X 15" 300 mm x 370 mm reflow area, cures SMD adhesive.

The Protoflow E is a powerful convectional desktop oven for lead free reflow soldering. Many pre-programmed process profiles can be easily selected via a LCD display and simple keyboard. All profile parameters, such as temperature and process duration, can be programmed individually for separate preheating and reflow phases. Profiles are defined by user names. A single or multiples PCB’s up to maximum working surface of 6.3" x 7.9" (200 x 160 mm) can be inserted.

The Gold-Flow™ GF-B-HT Shuttle Batch oven was designed for prototyping printed circuit board assembly and batch production runs. Capable for lead or lead-free soldering. While one PCB is being processed, another circuit board can be cooled and off-loaded, then a third board can be loaded and shuttled into the chamber for reflow

HA08 lead free SMT batch Reflow / quartz Oven system includes nitrogen (N2) inlet option that will allow you to process printed circuit boards in oxygen free ambiance, Nitrogen environment allows reduction of peak temperatures therefore nitrogen improves paste spread, increases wet ability, and produces shinier, more aesthetically pleasing solder joints.
This oven is perfect for your challenging lead free prototype PCB assembly projects. An energy efficient mixture of quartz infrared and hot-air convection, two heating zones with microprocessor controlled provides accurate heating at the higher temperatures required for lead-free soldering, 17" X 14" - 440 mm x 360 mm reflow area, cures SMD adhesive.

Convection SMT reflow ovens, ideal for lead-free reflow soldering, meeting the stringent demands of rapid printed circuit board soldering applications. The ProtoFlow S features even heat distribution, easy programming, and many pre-definied temperature profiles. The compact design and efficient power consumption make it one of the most useful components in any rapid printed circuit boards prototyping environment.

These are the reasons why you need the BM-W430 benchtop lead free reflow ovens;
1) When budget and factory floor space are considerations and you want to achieve your production requirement.
2) These reflow ovens have 4 upper and 4 bottom forced hot air convection a combination of high mass heat sources and efficient thermal heat transfer, allow high quality Lead-Free soldering resulting in uniform heating and exceptional process stability.
3)Temperature accuracy of ±1°C and, in conjunction with a high-speed CE certificated blower for maximum convection, ensure a temp uniform of ±2°C across the printed circuit boards assembly.
Other reasons are: Touch Screen, PLC control, Stainless steel Pin Chain and Mesh belt conveyor, stand with cabinet.

The GF-12HT SMT Reflow Oven uses a patented Horizontal Convection™ technology that circulates heated air in each chamber around the printed circuit board front to back which increases the thermal efficiency and uniformity within each zone. This exposes the circuit boards to a uniform temperature profile along the entire SMT PCB assembly. Cyclonic generator speed is independently set in each zone.

With touch screen control display, makes the use of an additional CPU unnecessary!! USB printer or storage device can directly be connected to the control.

The Mistral 260 convection reflow soldering systems uses re-circulated hot air to accomplish reflow at much lower temperatures than IR systems.
Using constant, even heating, a great variety of board sizes will reach reflow temperature with the same heat profile. By eliminating set-up time your production line can work to its fullest capacity.

The BM-W630 bench top reflow ovens advantages:
1) When budget and factory floor space are considerations and you want to achieve your production requirement.
2) These reflow ovens have 6 upper and 6 bottom forced hot air convection a combination of high mass heat sources and efficient thermal heat transfer, allow high quality Lead-Free soldering resulting in uniform heating and exceptional process stability.
3) Temperature accuracy of ±1°C and, in conjunction with a high-speed CE certificated blower for maximum convection, ensure a Temp uniform of ±2°C across the Printed circuit boards assembly.
Other reasons are the Oven comes with all of this included; Touch Screen, PLC control, Stainless steel Pin Chain and Mesh belt conveyor, stand with cabinet.

Three (3) heating zone reflow ovens for batch production runs utilizing our patented Horizontal ConvectionTM Heating technology for extremely uniform temperature profiling across the printed circuit board for enhanced process control. The GF-120HT is lead-free compatible for RoHS compliant soldering

With touch screen control display, makes the use of an additional CPU unnecessary!! USB printer or storage device can directly be connected to the control.

The Mistral 360 convection reflow soldering system uses re-circulated hot air to accomplish reflow at much lower temperatures than IR systems. Using constant, even heating, a great variety of board sizes will reach reflow temperature with the same heat profile. By eliminating set-up time your production line can work to its fullest capacity. Convection heating provides other advantages over IR. In addition tot the wide process window, it works with:

RO-403 Full Convection Reflow Ovens offer full forced hot air heating to maintain consistent edge-to-edge temperatures, regardless of printed circuit board component size or density,an ideal profile, preheat temperatures are maintained long enough to permit activation of fluxes, while exposure of the components to higher reflow temperatures is kept to a minimum. 8 independently-controlled heating zones, with bottom side heating also adjustable to prevent overheating of inverted components on double-sided boards.
LCD display permits continuous monitoring of the production run, with real time profiling shown in convenient graph format and circuit board temperatures through each zone. To eliminate the possibility of damage caused by static charges, the Breeze includes an air ioniser in the cool down zone as standard equipment.

RO-413 Full Convection Reflow Ovens offer full forced hot air heating to maintain consistent edge-to-edge temperatures, regardless of printed circuit board component size or density,an ideal profile, preheat temperatures are maintained long enough to permit activation of fluxes, while exposure of the components to higher reflow temperatures is kept to a minimum. 8 independently-controlled heating zones, with bottom side heating also adjustable to prevent overheating of inverted components on double-sided boards.
LCD display permits continuous monitoring of the production run, with real time profiling shown in convenient graph format and circuit board temperatures through each zone. To eliminate the possibility of damage caused by static charges, the Breeze includes an air ioniser in the cool down zone as standard equipment.

This lead-free mid-sized reflow oven is specially designed for mid production users, the self-developed controller is specially design for the lead-free wave solder machine and reflow oven.
6 Upper and 6 bottom zones fully forced hot air convection featuring a proprietary combination of high mass heat sources and efficient thermal heat transfer. The result is uniform heating and exceptional process stability. Temperature accuracy of ±1°C because of this conjunction with both Upper and bottom zones fully forced hot air for maximum convection ensure a Temp uniform of ±2°C across circuit boards fabrication.

Lead-free mid-sized reflow ovens and wave soldering machines are specially designed for mid production users, the self-developed controller is specially design for the lead-free wave solder machine and reflow oven.
8 Upper and 8 bottom zones fully forced hot air convection featuring a proprietary combination of high mass heat sources and efficient thermal heat transfer. The result is uniform heating and exceptional process stability. Temperature accuracy of ±1°C because of this conjunction with both Upper and bottom zones fully forced hot air for maximum convection ensure a Temp uniform of ±2°C across the SMT printed circuit board manufacturing.

SF-8C Lead free Reflow ovens are specially designed for production.
with 8 upper and 8 bottom air zones, both Upper and bottom zones fully forced hot air convection a combination of high mass heat sources and efficient thermal heat transfer, allow high quality Lead-Free soldering resulting in uniform heating and exceptional process stability.
Temperature accuracy of ±1°C because of this conjunction with both Upper and bottom zones fully forced hot air for maximum convection, ensure a Temp uniform of ±2°C across the Printed circuit boards assembly.
These Ovens have included; pin chain & mesh belt conveyor, industrial chiller for cooling and PC control, and now they have also included a Flux Management System, and a Blower Speed Control by Transducer. Please see overview and spec for more details.

The Mistral 460 convection reflow soldering system uses re-circulated hot air to accomplish reflow at much lower temperatures than IR systems. Full Convection Reflow Ovens offer full forced hot air heating to maintain consistent edge-to-edge temperatures, regardless of printed circuit board component size or density,an ideal profile, preheat temperatures are maintained long enough to permit activation of fluxes, while exposure of the components to higher reflow temperatures is kept to a minimum.
With touch screen control display, makes the use of an additional CPU unnecessary!! USB printer or storage device can be directly connected to the control.

SF-10C Lead-free Reflow ovens are specially designed for production.
10 upper and 10 bottom air zones, both Upper and bottom zones fully forced hot air convection a combination of high mass heat sources and efficient thermal heat transfer, allow high quality Lead-Free soldering resulting in uniform heating and exceptional process stability.
Temperature accuracy of ±1°C because of this conjunction with both Upper and bottom zones fully forced hot air for maximum convection, ensure a Temp uniform of ±2°C across the Printed circuit boards assembly.
Other reasons are the Oven comes with all of this included; pin chain & mesh belt conveyor, industrial chiller for cooling and PC control, and now we are including Flux Management System, Blower Speed Control by Transducer. Please see overview and spec for more details.

The RO-500 Solano convection LEAD FREE oven, the process chambers are Specially designed to transfer the heat with a minimum of stress for the components, even with lead free applications, temperatures stay below the critical PCB component temperatures. The process chambers allow exact control of each cell and guarantee a uniform airflow across the printed circuit board
All heating zones, top and bottom, are separately controlled by a built in microprocessor controller with graphic display allowing you to plot temperature profiles on screen, and the optional windows based PC software, informs you of the status of all controls.

RO-510 Solano convection oven are DIMA’s answer to the demanding LEAD FREE production of printed circuit boards' processes . Special designed process chambers transfer the heat with a minimum of stress for the components. Even with lead free applications temperatures stay below the critical component temperatures.
All heating zones, top and bottom, are heated by circulating hot air, and are separately controlled by a built in microprocessor controller with graphic display allowing you to plot temperature profiles on screen.