The Gold-Flow™ GF-SL Single Hot Plate is used for a variety of heating applications which include preheat, rework, reflow and curing of printed circuit board assemblies.

The Gold-Flow™ GF-DL Dual Hot Plate is used for a variety of heating applications which include preheat, rework, reflow and curing of printed circuit board assemblies. The Dual Hot Plate model GF-DL is similar to the GF-SL, but with two independent temperature controls and dual 13˜ x 6.4˜ plates.

The T200C SMT batch reflow oven is perfect for entry level lead free prototype assembly. With a maximum PCB reflow area of 360mm*230mm (14"x9") this oven can handle most of your SMT assembly needs. Available in 110v or 220v the T200C is ready for lead free solder reflowing with a short 3 minute warm up. Featuring up to 40 programmable temperature setpoints a reflow profile curve of 3 min +/- 1 min can be set and saved to the customer supplied PC. The saved profile can then be recalled for use at a later time. This reflow toaster oven couples the flexibility of a small desktop footprint with the ability to precisely control the reflow profile curve

The Gold-Flow™ GF-C2 Dual Function Batch Oven or Hot Plate is ideal for batch SMT reflow, curing and hot plate applications. With its heavy duty construction and stainless steel chamber, the oven is designed for many years of reliable service.

The GF-C conduction/convection oven has a unique dual function as a hot plate or as a forced air convection oven.

The T200N SMT batch reflow oven with nitrogen inlet is perfect for your challenging lead free prototype assembly projects. With a maximum PCB reflow area of 360mm*230mm (14"x9") this oven can handle most of your SMT assembly needs. Available in 110v or 220v the T200N is ready for lead free solder reflowing with a short 3 minute warm up. Featuring up to 40 programmable temperature setpoints a reflow profile curve of 3 min +/- 1 min can be set and saved to the customer supplied PC. The saved profile can then be recalled for use at a later time. This reflow toaster oven couples the flexibility of a small desktop footprint with the ability to precisely control the reflow profile curve. With the addition of nitrogen purge capability for the reflow environment this batch reflow oven is head and shoulders above the competition.

Hot air / quartz oven
Outstanding reflow soldering quality for SMD and hybrid
Cures SMD adhesive
Two heating zones
Microprocessor controlled

Hot air / quartz oven
Outstanding reflow soldering quality for SMD and hybrid
Cures SMD adhesive
Two heating zones
Microprocessor controlled

The Gold-Flow™ GF-B Shuttle Batch Oven has a unique shuttle system that enables a higher throughput than standard batch SMT reflow ovens. Both sides of the oven have a cooling station, and while one board is being processed, another board can be cooled and off loaded, then a third board can be loaded and shuttled into the chamber for reflow.

The ProtoFlow is a premiere convection SMT reflow oven, ideal for lead-free reflow soldering, meeting the stringent demands of rapid PCB soldering applications. The ProtoFlow features even heat distribution, easy programming, and many pre-definied temperature profiles. The compact design and efficient power consumption make it one of the most useful components in any rapid PCB prototyping environment.

The GF-12HC SMT Reflow Oven uses a patented Horizontal Convection™ technology that circulates heated air in each chamber around the board front to back which increases the thermal efficiency and uniformity within each zone. This exposes the circuit board to a uniform temperature profile along the entire assembly. Cyclonic generator speed is independently set in each zone.

With touch screen control display, makes the use of an additional CPU unnecessary!! USB printer or storage device can directly be connected to the control.

The Mistral 260 convection reflow soldering systems uses re-circulated hot air to accomplish reflow at much lower temperatures than IR systems.
Using constant, even heating, a great variety of board sizes will reach reflow temperature with the same heat profile. By eliminating set-up time your production line can work to its fullest capacity.

These SMT reflow ovens are designed for higher production assembly than the smaller GF-12 series. The new Horizontal Convection? technology is ideal for lead-free soldering parameters. With the patented Horizontal Convection?, air is circulated horizontally in one direction above the board, and in theopposite direction below the board. This circular air current, or ?cyclone? around the board, produces extremely uniform temperature profiles across the board. The model GF-120HT are high temperature ovens which are compatible with all lead free soldering applications.

With touch screen control display, makes the use of an additional CPU unnecessary!! USB printer or storage device can directly be connected to the control.

The Mistral 360 convection reflow soldering system uses re-circulated hot air to accomplish reflow at much lower temperatures than IR systems. Using constant, even heating, a great variety of board sizes will reach reflow temperature with the same heat profile. By eliminating set-up time your production line can work to its fullest capacity. Convection heating provides other advantages over IR. In addition tot the wide process window, it works with:

With touch screen control display, makes the use of an additional CPU unnecessary!! USB printer or storage device can directly be connected to the control.

The Mistral 460 convection reflow soldering system uses re-circulated hot air to accomplish reflow at much lower temperatures than IR systems. Using constant, even heating, a great variety of board sizes will reach reflow temperature with the same heat profile. By eliminating set-up time your production line can work to its fullest capacity.

Convection heating provides other advantages over IR. In addition tot the wide process window, it works with: