The MM-1 Mini Mirror allows the user to inspect solder joints of a BGA component before and after the reflow at the BGA rework process. The operator will be able to visually inspect the outer row of solder joints to determine proper wetting, and alignment.

The flexibility of the tool allows the user to be able to change the angle of the BGA Inspection Mirror so that the solder sphere connection to the package as well as the PCB can be seen.

When you consider that all of these advantages are available at this price, the Mini Mirror is clearly without equal. Keep in mind that when it comes to visual inspection . . . SIZE COUNTS.

Allows the operator to inspect the solder joints of BGA components before and after the rework-reflow process.

The photos below show that the wide field of view of the Mini Mirror permits outstanding images as compared to other tools that are on the market at over 5 times the Mini Mirror.