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R200A Benchtop SMT Reflow Oven
Part #: R200A
Lead Time: 2-4 weeks
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| Item |
Parameter |
| Model |
R200A |
| Temperature control segment |
With a maximum of 40 segments the R200A is an effective prototype batch oven for low volume SMT reflow. |
| Temperature-zone numbers |
Single segment and multi-segment control.
You can either setup a profile curve for reflow or set a constant peek temperature.
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| Temperature control system |
Automatic built in temperature control with PID intelligence microcomputer. SSR non-contact output. |
| Temperature accuracy |
± 2 |
| Warm-up time |
3 Min |
| Temperature range |
Room-temperature-350 deg. C, designed to handle high temperatures the R200A batch reflow oven is suitable for lead-free soldering. |
| Heating supply |
Infrared ray + Hot air convection |
| Effective working table area |
360mm*230mm(14"x9") |
| Reflow cycle time |
3min ±1min |
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Reflow profiles can be stored on the machine. |
| Cooling system |
Transverse flow equal cooling |
| Rated voltage |
Available in standard 110 and 220 VAC single-phase 50Hz. |
| Rated power |
3.8KW |
| Mean power |
1.6kw |
| Weight |
45kg (100 Lbs) |
| Dimension |
Length*width*height 700*460*310mm (28" 18.12" 12.25") |
| Warranty |
1 yr manufacturer warranty for manufacturer or equipment defect. Repair support provided by phone and e-mail.
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Main features
- Precise temperature controls and ease of operation are just two of the highlights of this lead free capable SMT Batch reflow oven. It satisfies all lead free soldering requirements for the small 0201 components all the way up to fine pitch QFP's and challenging BGA or CSP packages. While designed for the Prototype pcb assembly industry the R200A Benchtop reflower is precise enough to be used in laboratory environments.
- Energy-saving power supply designed for high efficiency to reduce electricity usage.
Capable of curing adhesives such as chip bonder materials.
- Robust design enables long life even with frequent use.
- Clear glass door for visibility of product.
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