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R200C Benchtop SMT Reflow Oven
Part #: R200C
Lead Time: 2-4 weeks
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| Item |
Parameter |
| Model |
R200C |
| Temperature control segment |
Computer controlled with a maximum of 40 segments the R200C is an effective prototype batch oven for low volume high mix lead free SMT reflow. |
| Temperature-zone numbers |
Single segment and multi-segment control
You can either setup a profile curve for reflow or set a constant peek temperature
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| Temperature control system |
PCB software driven programmable temperature control and SSR non-contact output. |
| Temperature accuracy |
± 2 |
| Warm-up time |
3min |
| Temperature range |
Room-temperature-360 deg. C, designed to handle high temperatures the R200C batch reflow oven is suitable for lead-free soldering. |
| Heating supply |
Infrared ray + Hot air convection |
| Effective working table area |
360mm*230mm(14"x9") |
| Reflow cycle time |
3min ±1min |
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360mm*230mm(14"x9") |
| Cooling system |
Transverse flow equal cooling |
| Rated voltage |
Available in standard 110 and 220 VAC single-phase 50Hz. |
| Rated power |
3.8KW |
| Mean power |
1.6kw |
| Weight |
39Kg (79.37 Lbs) |
| Dimension |
Length*width*height 700*460*310mm (28" 18.12" 12.25") |
| Warranty |
1 yr manufacturer warranty for manufacturer or equipment defect
Repair support provided by phone and e-mail
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Main features
- The R200C features on the fly profile monitoring and adjustment in an easy to use software environment. The changes are then clearly displayed on the profile curve and temperature segment setting screens.
- Precise temperature controls and ease of operation are just two of the highlights of this lead free capable SMT Batch reflow oven. It satisfies all lead free soldering requirements for the small 0201 components all the way up to fine pitch QFP's and challenging BGA or CSP packages. While designed for the Prototype pcb assembly industry the R200C Benchtop reflower is precise enough to be used in laboratory environments.
- Energy-saving power supply designed for high efficiency to reduce electricity usage.
Capable of curing adhesives such as chip bonder materials.
- Robust design enables long life even with frequent use.
- Clear glass door for visibility of product.
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