This BGA Rework Stencil was specially designed to make your rework faster and simpler. It uses a breakthrough method that allows you to simplify the placement/replacement of area array devices such as BGAs and CSPs as well as other leaded SMT devices.

Key features:

BGA Rework Stencil Thickness: .004" (0.102mm)

Aperture Size: .021" (.53mm)

Ball Count: 48

Ball Pattern: 6 x 8 Full Array

Pitch: .050" (.75mm)

Component Body Size: 7mm x 7mm

Standard lead time is (5) business days, 24-48hr expedites are also available. Stencil Quik comes in a pack of 10 BGA rework stencils.