This BGA Rework Stencil was specially designed to make your rework faster and simpler. It uses a breakthrough method that allows you to simplify the placement/replacement of area array devices such as BGAs and CSPs as well as other leaded SMT devices.

Key features:

BGA Rework Stencil Thickness: .008" (.203mm)

Aperture Size: .036" (.92mm)

Ball Count: 360

Ball Pattern: 19 x 19 Full Array

Pitch: .050" (1.27mm)

Component Body Size: 25mm x 25mm

Standard lead time is (5) business days, 24-48hr expedites are also available. Stencil Quik comes in a pack of 10 BGA rework stencils.