For Preheat, Rework and Reflow!
Used for a variety of heating applications which include preheat, rework, reflow and curing of printed circuit board assemblies.

The Dual Hot Plate model GF-DL is the same as the GF-SL , but with two independent temperature controls and dual 13˜ x 6.4˜ plates.

• Large 13˜ x 13˜ heating area
• HT model option: temperatures up to 600° F*
• 3/4˜ thick aluminum heat plates for precise, even heating
• Programmable digital temperature controller precisely and automatically regulates temperatures
• CE compliant

Lead Free (RoHS compliant) Option*
The GF-DL-HT Dual Hot Plate High Temperature option is also available for Lead Free Soldering.