Lead Free (RoHS compliant) Option
A High Temperature option (GF-B-HT) is also available for Lead Free Soldering.
This unique shuttle system enables a higher throughput than standard batch reflow ovens.
Both sides of the oven have a cooling station, and while one board is being processed, another board can be cooled and off loaded, then a third board can be loaded and shuttled into the chamber for reflow.
- Lead Free Soldering capability (GF-B-HT model) Max. Temp. 315° C (600° F)
- Unique shuttle system enables higher throughput than standard batch ovens
- Large top window allows the operator to see the board through the entire process
- 100% cyclonicTM forced air convection
- Independent time and temperature microprocessorcontrols with membrane keypad make set-up easy
- 99 menu storage with password protection
- All stainless steel interior construction
- Dual cooling stations
- English or metric units
- Nitrogen gas inerting option
|
