NC520/NC254 No Clean Solder Paste (Leaded or Lead Free)

NC520/NC254 No Clean Solder Paste (Leaded or Lead Free)

Part #: NC520-NC254
Lead Time: Syringe and Jar In Stock
AIM’s NC520 and NC254 are designed for the most demanding high density electronic assemblies. They have been developed to offer excellent wetting, improved printing and to reduce voiding during the circuit board assembly process.
  • Alloy Sn63/Pb37 MP=183°C
  • High Density Assemblies
  • Excellent Wetting
  • Alloy SAC305 MP=217°C (Lead Free)
  • Stencil Life > 8 Hours
  • T4 in stock and ready to ship
Features
NC520 NC254
  • For Use with Demanding High Density Electronic Assemblies
  • Reduced Head-in-Pillow
  • Extremely Stable Formula
  • Extended Pause-to-Print Process Window
  • Reduces Voiding on QFN Ground Pads
  • Improved Printing Characteristics
  • Broad Printing Process Window
  • Excellent Wetting, Even Leadless Devices
  • 24 Hour Stencil Life
  • Clear Pin-Probe Testable Residue
  • Reduces Voiding Under Micro-BGAs
  • 12-14 Hour Tack Time
  • Halide-Free

Product Description
NC520 is designed for the most demanding high density electronic assemblies. NC520 has been developed to offer excellent wetting, improved printing and to reduce voiding. The superior wetting ability of NC520 results in bright, smooth and shiny solder joints with SAC alloys. An innovative activator system offers excellent wetting in a wide range of profiles. Enhanced wetting will reduce voiding on QFN ground planes, LGA and BGA interconnects. NC520 consistent transfer efficiencies reduce head-in-pillow (HiP) even when component/substrate co-planarity is not optimal.

NC520 SN62/SN63 Datasheet
NC520 SAC305 Datasheet
Material Safety Data Sheets (MSDS)
NC520 SAC305 MSDS
NC520 SN62/SN63 MSDS

NC254 has been developed to offer extremely broad process windows for printing, wetting and pin probe testing. The superior wetting ability of NC254 results in bright, smooth, shiny, solder joints. NC254 offers very low post process residues, which remain crystal clear and probable even at the elevated temperatures required for today's lead free alloys. NC254 has shown to reduce or eliminate voiding under micro-BGAs. NC254 also offers high humidity tolerance and a chemistry developed for use in air reflow. Slump and humidity tolerances found in NC254 extend the solder pastes useable life in facilities where environmental control is not at its optimum.

NC254 SN62/SN63 Datasheet
NC254 SAC305 Datasheet
Material Safety Data Sheets (MSDS)
NC254 SN62/SN63 MSDS
NC254 SAC305 MSDS

Printing
NC520
  • Apply sufficient paste to the stencil to allow a smooth, even roll during the print cycle. A bead diameter of 15-20mm (index finger) is sufficient.
  • The application of small amounts of fresh solder paste to the stencil at controlled intervals will maintain paste chemistry rather than one large deposit over an extended period of time.
  • NC520 is formulated to maintain excellent transfer efficiency after extended pauses, however, a knead cycle after pauses longer than 60 minutes will improve performance.
  • Cleaning of your stencil will vary by application; however, if solvent is required use of AIM DJAW-10 stencil cleaner, either by hand or in automated stencil cleaners is preferred.
  • Isopropyl Alcohol (IPA) is NOT recommended for cleaning stencils during the printing process.

NC254
  • Apply sufficient paste to the stencil to allow a smooth, even roll during the print cycle (a bead diameter of 12 to 16mm (˝ to ⅝ inch) is normally sufficient to begin).
  • Apply small amounts of fresh solder paste to the stencil at controlled intervals to maintain paste chemistry and workable properties.
  • NC254 provides the necessary tack time and force for today’s high speed placement equipment, which will enhance product performance and reliability.
  • Cleaning of your stencil will vary by application; however, it can be accomplished using AIM 200AX-10 stencil cleaner.
  • Snap-off distance = on contact 0.00 mm (0.00")
  • PCB Separation Distance = 0.75-2.0 mm (.030-.080")
  • PCB Separation Speed = Slow
  • Squeegee Pressure = 0.10-0.30 kg/cm (.6 -1.7 lbs/in.) of blade.
  • Squeegee Stroke Speed = 25-50 mm/sec. (1-2 in./sec.)
* Note: Recommended initial printer settings above are dependent on PCB and pad design

Cleaning
NC520 is not required; however, it can be cleaned if necessary with saponified water or an appropriate solvent cleaner. NC254 can be cleaned if necessary with saponified water or an appropriate solvent cleaner.

Reflow Profile
Please refer to datasheets.

Handling and Storage
  • NC520 is best used within 6 months at 4° C-12° C (40° F-55° F) or 4 months at room temperature and NC254 is best used within 9 months at 4° C-12° C (40° F-55° F) or 4 months at room temperature..
  • Allow the solder paste to warm up completely and naturally to ambient temperature (8 hrs.) prior to breaking the seal for use.
  • Mix the product lightly and thoroughly (1-2 minutes max).
  • Do not store new and used paste in the same container. Reseal any opened containers while not in use.
  • Replace the internal plug and cap of the 500 gram jars to minimize exposure of the unused paste to the atmosphere.

Physical Properties
ITEM SPECIFICATION
NC520 NC254
Alloy Sn62 and Sn63 SAC305 Sn63 and Sn62 SAC 305
Appearance Gray, Smooth, Creamy
Melting Point 183° C 217° -218° C 183°C 217° -218° C
Particle Size T4 T3, T4 T3, T4, T5 T3, T4, T5
Metal Loading - - 90% (T3) 88.5% (T3)
Viscosity Per J-STD-005 IPC TM 650 2.4.34 Print/Dispense
Packaging Available in all industry standard packaging.

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