NC165 No Clean Flux

NC165 No Clean Flux

Temporarily Out Stock
Part #: VOC503 VOC FLUX
Lead Time: 4 Days
Data Sheet: Download PDF File
NC165 NO CLEAN FLUX is a halide-free, no clean activated material formulated to work with Printed Circuit Board Assembly’s SN100C Bar Solder and standard Sn/Pb Alloys. NC165 eliminates solder balls while providing excellent solderability with minimal flux residue.

  • A solder temperature of 250-260 degrees C should be maintained
  • Excellent Solderability
  • Available in 1 Gallon Container
Solids Content:3.4-3.8%
Specific Gravity at 20 Degrees C: 0.80 – 0.84
Acid Number (mgKOH/gm): 22 - 26
Color: Clear to light amber
Copper Mirror: Low Activity
J-STD-004 Classification: ORL0
Halides Content:0.00%
Product Description
NC165 has slightly lower solids content than NC160 for applications where less flux residue is desired.

Material Safety Data Sheets (MSDS)
NC1165 No Clean Flux MSDS

  • The specific gravity of the flux should be maintained between 0.80 and 0.84.
  • The amount of flux to be applied during foaming applications should be between 800 and 1300 micrograms per square inch of solids.
  • The amount of flux to be applied during spray application should be between 475 and 850 micrograms per square inch of solids.

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Price:  $110.00