NC165 No Clean Flux

NC165 No Clean Flux

Temporarily Out Stock
Part #: VOC503 VOC FLUX
Lead Time: 4 Days
Data Sheet: Download PDF File
NC165 NO CLEAN FLUX is a halide-free, no clean activated material formulated to work with Printed Circuit Board Assembly’s SN100C Bar Solder and standard Sn/Pb Alloys. NC165 eliminates solder balls while providing excellent solderability with minimal flux residue.

  • A solder temperature of 250-260 degrees C should be maintained
  • Excellent Solderability
  • Available in 1 Gallon Container
Solids Content:3.4-3.8%
Specific Gravity at 20 Degrees C: 0.80 – 0.84
Acid Number (mgKOH/gm): 22 - 26
Color: Clear to light amber
Copper Mirror: Low Activity
J-STD-004 Classification: ORL0
Halides Content:0.00%
Product Description
NC165 has slightly lower solids content than NC160 for applications where less flux residue is desired.

Material Safety Data Sheets (MSDS)
NC1165 No Clean Flux MSDS

Information:
  • The specific gravity of the flux should be maintained between 0.80 and 0.84.
  • The amount of flux to be applied during foaming applications should be between 800 and 1300 micrograms per square inch of solids.
  • The amount of flux to be applied during spray application should be between 475 and 850 micrograms per square inch of solids.

Customer Reviews

This product has no reviews, please share your opinion of the product

Write a review
PRODUCT PRICING
Price:  $110.00