NC160 Lead Free Flux

NC160 Lead Free Flux

Part #: NC160 LEAD FREE FL
Lead Time: 4 Days
Data Sheet: Download PDF File
NC160 NO CLEAN FLUX is a halide-free, no clean activated material for printed circuit board surface mounting. NC160 is formulated to work with Printed Circuit Board Assembly’s SN100C Bar Solder.

  • A solder temperature of 250-260 degrees C should be maintained
  • Excellent Solderability
  • Available 1 Gallon Container
Solids Content: 5.5-6.0% wt
Specific Gravity at 20 Degrees C: .81-.84
Acid Number (mgKOH/gm): 22-27
Color: Clear to light amber
Copper Mirror: Low Activity
J-STD-004 Classification: ROL0
Halides Content:0.00%
Product Description
NC160 eliminates solder balls while providing excellent solderability with minimal flux residue so that cleaning is not necessary.

Material Safety Data Sheets (MSDS)
NC160 Lead Free Flux MSDS

  • Specific Gracvity should be maintained between .81 and .84
  • Amount of flux applied during foaming applications should be between 800 and 1300 micrograms per square inch of circuit.
  • Amount of flux to be applied during spray should be between 475 and 850 micrograms per square inch of circuit

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Price:  $25.00