NC-560-LF Lead-Free No-Clean Solder Paste (250gr jar)

NC-560-LF Lead-Free No-Clean Solder Paste (250gr jar)

Part #: NC-560-LF
Lead Time: 250 Gram Jar In Stock
Data Sheet

NC-560-LF is a lead-free, no-clean, halide-free solder paste that delivers improved solderability with all Pb-Free metallization, including ENIG (Gold), OSP, HASL and immersion silver printed circuit boards. This solder paste is also low beading, low voiding, and anti-tombstoning to reduce scrap and rework.

  • Exceptional print definition
  • Long stencil life > 8 hours
  • Excellent wetting compatibility
  • Wide process window
  • Low voiding
  • Clear residue
Product Description
NC-560-LF is a lead-free, no-clean, halide-free solder paste that delivers improved solderability with all Pb-Free metallization, including ENIG (Gold), OSP, HASL and immersion silver printed circuit boards. NC-560-LF is RoHS-compliant and increases production yields with its unparalleled lot-to-lot and stencil printing consistency, and offers superior print performance characteristics, including excellent wetting, strong activity, ideal viscosity, long stencil life, thermal stability up to 300°C, and minimal residue. NC-560-LF is also low beading, low voiding, and anti-tombstoning to reduce scrap and rework.

Material Safety Data Sheets (MSDS)
NC-560-LF MSDS

Attributes
  • Exceptional print definition
  • Long stencil life
  • Wide process window
  • Excellent wetting compatibility on most PCB finishes
  • Low voiding
  • Compatible with enclosed printing heads
  • Compatible in either Nitrogen or Air reflow

Product Information
Alloy
  • Sn96.5/Ag3.0/Cu.5
  • Applications
  • Automatic / Manual Printing
  • Automatic / Manual Dispensing
  • Powder Size
  • Type-3
  • Type-5 available upon request
  • Packaging
  • 250 gram jars
  • 500 gram jars upon request
  • Other packaging upon request
  • Stencil Life
  • 8 hrs. @ 30–45% RH & 22–25°C
  • ~4 hrs. @ 45–70% RH & 22–25°C
  • Viscosity
  • Printing applications: 650 to 900Kcps +/-10%
  • Dispensing applications: 425Kcps +/-10%
  • Tested according to IPC-TM-650
  • Tack Value
  • Typical tackiness: 35g force

  • Printing

    The print definition of NC-560-LF is ideal for fine pitch applications. The stencil life of this no-clean product virtually eliminates waste of solder paste. This type 3 solder paste will meet pitch requirements from 16 mil to 24 mil.

    Printer Operation

    The following are general guidelines for stencil printer optimization with NC-560-LF. Some adjustments may be necessary based on your process requirements:

  • Print Speed: 25–100mm/sec
  • Squeegee Pressure: 0.2–0.7kg/inch of blade
  • Under Stencil Wipe: Once every 10–25 prints or as necessary
  • Stencil Cleaning

    Automated stencil cleaning systems for both stencil and misprinted printed circuit boards. Manual cleaning using 99% isopropyl alcohol (IPA) works well.


    Storage and Handling

    • Refrigerated storage at 42–47°F will prolong the solder paste shelf life to no less than 6 months
    • Syringes & cartridges should be stored vertically with the dispensing tip down.
    • Solder paste should be allowed to reach ambient temperature naturally, prior to use (about 6-8 hours).
    • Never freeze solder paste.

    Heating
    Read the data sheet to find specifications about the recommended temperature profile.

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    Price:  $65.00