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Metal BGA Reballer
Part #: BGA-RBLLR-MTL
Lead Time: 2-3 days
Quick Overview
The Metal BGA Reballer comes with a FR4 base where the BGA component is placed, a flux printing stencil and hold down plate. The entire assembly can now be run through reflow.
Suited for printed circuit board assembly.
Metal BGA Reballer
The Metal BGA Reballer comes with a FR4 base where the BGA component is placed, a flux printing stencil and hold down plate. The entire assembly can now be run through reflow.
Suited for printed circuit board assembly.
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Instructions
1. The BGA component is placed in the FR4 base.
2. A flux printing stencil is placed over the pins to line up with the BGA component and the hold down plate is placed on top.
3. Flux is printed onto the BGA.
4. The flux stencil and hold down plate are removed (while leaving the BGA component in place).
5. The re-ball stencil is now placed over the pins to line up with the BGA component and the hold down plate is placed on top.
6. Balls are placed on top of the stencil and rolled around until all hole locations are filled.
7. The entire assembly can now be run through reflow.
8. After reflow, remove hold down plate, stencil, and BGA component and repeat for other components.
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