HM531 Water-Soluble Solder Paste

HM531 Water-Soluble Solder Paste

Part #: HM531
Lead Time: 600 Gram Cart. In Stock
Data Sheet
Kester HydroMark 531 is an organic acid, water-soluble solder paste that provides users with the highest level of consistency and performance. Batch after batch, HM531 provides hours of stable stencil life, tack time, repeatable brick definition and is ideal for printed circuit board assembly.
  • Alloys: Sn63Pb37 or Sn62Pb36Ag02
  • Stencil Life >8+ hours
  • Capable to a maximum speed of 150 mm/sec
  • Stable tack life
  • Lead free
  • Residue removes easily
*New Item

Product Description
HM531’s robust printing characteristics result in consistent solder paste volume regardless of idle time, stencil life and print speed. The activator package in the HM531 is very aggressive and provides superior wetting to OSP-coated PCB’s and Ag/Pd components. The outstanding batch consistency, anti-slump chemistry, consistent print volumes, solderability and cleanability make the HM531 an ideal water-soluble solder paste for any application.

Attributes
  • HM531 provides outstanding batch-to-batch consistency
  • Excellent anti-slump characteristics minimizing bridging defects
  • High print speeds up to 150 mm/s
  • Excellent solderability to a wide variety of metallizations, including Palladium, leaving bright, shiny joints
  • Residues easily removed with hot DI water, even up to 48 hours after soldering
  • 8+ hour stencil life.

Product Information
Alloys
  • Sn63Pb37 or Sn62Pb36Ag02
Applications
  • 90% Metal – Stencil Printing and 90% Metal – Enclosed Head Printing
Powder Size
  • Type 3 powder mesh powder is recommended-different sizes are available
  • Packaging
    • 600 gram cartridge.

    Printing
    • Squeegee Blade 80 to 90 durometer polyurethane or stainless steel
    • Squeegee Speed Capable to a maximum speed of 150 mm/sec (6 in/sec)
    • Stencil Material Stainless Steel, Molybdenum, Nickel Plated, Brass
    • Temperature/Humidity Optimal ranges are 21-25°C (70-77°F) and 30-70% RH
    Storage and Handling
    • Refrigeration is the recommended optimum storage condition for solder paste to maintain consistent viscosity, reflow characteristics, and overall performance.
    • HM531 should be stabilized at room temperature prior to printing.
    • HM531 should be kept at standard refrigeration conditions, 0-10°C (32-50°F)
    • Shelf life is 6 months from date of manufacture when handled properly and held at 0-10°C (32-50°F)

    Cleaning
    • HM531 residues are best removed using automated cleaning equipment (in-line or batch) within 48 hours of soldering. De-ionized water is recommended for the final rinse. Water temperatures should be 49–60°C(120-140°F). Kester’s 5768 Bio-Kleen® saponifier can also be used in a 1-2% ratio for aqueous cleaning systems.

    Customer Reviews

    This product has no reviews, please share your opinion of the product

    Write a review
    PRODUCT PRICING
    Price:  $84.00