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HA08 SMT Refow Quartz oven
Part #: HA08
Lead Time: 2-4 weeks
Quick Overview
HA08 lead free SMT batch Reflow / quartz Oven system includes nitrogen (N2) inlet option that will allow you to process printed circuit boards in oxygen free ambiance, Nitrogen environment allows reduction of peak temperatures therefore nitrogen improves paste spread, increases wet ability, and produces shinier, more aesthetically pleasing solder joints.
This oven is perfect for your challenging lead free prototype PCB assembly projects.
An energy efficient mixture of quartz infrared and hot-air convection, two heating zones with microprocessor controlled provides accurate heating at the higher temperatures required for lead-free soldering, 17" X 14" - 440 mm x 360 mm reflow area, cures SMD adhesive.
HA08 SMT Refow Quartz oven
HA08 lead free SMT batch Reflow / quartz Oven system includes nitrogen (N2) inlet option that will allow you to process printed circuit boards in oxygen free ambiance, Nitrogen environment allows reduction of peak temperatures therefore nitrogen improves paste spread, increases wet ability, and produces shinier, more aesthetically pleasing solder joints.
This oven is perfect for your challenging lead free prototype PCB assembly projects.
An energy efficient mixture of quartz infrared and hot-air convection, two heating zones with microprocessor controlled provides accurate heating at the higher temperatures required for lead-free soldering, 17" X 14" - 440 mm x 360 mm reflow area, cures SMD adhesive.
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| Model |
HA08 |
| Power requirements Max: |
Single phase 208/240 V. 50/60 Hz. |
| Rated power max. |
3950 W. |
| Max. substrate surface: |
17" X 14" - 440 mm x 360 mm |
| Two heating zones |
microprocessor controlled. |
| Preheat time: |
0-999 sec. |
| Preheat temp: |
140-320°F - 60-160°C. |
| Reflow time: |
0-999 sec. |
| Reflow temp: |
194-572°F - 90-300°C. |
| Heat up time to thermal stabilization: |
approx. 10 min. |
| Net weight: |
75 lbs - 34 kg. |
| Connection inert gas N2. |
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| All specifications are subject tot change without notice. |
Warranty= 12 month |
HA08 lead free SMT batch Reflow / quartz Oven system includes nitrogen (N2) inlet option that will allow you to process printed circuit boards in oxygen free ambiance, Nitrogen environment allows reduction of peak temperatures therefore nitrogen improves paste spread, increases wet ability, and produces shinier, more aesthetically pleasing solder joints. This oven is perfect for your challenging lead free prototype PCB assembly projects.
An energy efficient mixture of quartz infrared and hot-air convection, two heating zones with microprocessor controlled provides accurate heating at the higher temperatures required for lead-free soldering, 17" X 14" - 440 mm x 360 mm reflow area, cures SMD adhesive.
- Power requirements: 208/240 V 1 phase 50/60 Hz.
- Rated power max. 3950 W.
- Max. Substrate surface:17" X 14" - 440 mm x 360 mm.
- Two heating zones, microprocessor controlled.
- Preheat time:0-999 sec.
- Preheat temp:140-320°F. 60-160°C.
- Reflow Time: 0-999 sec.
- Reflow temp: 194-572°F. 90-300°C.
- Heat up time to thermal stabilization: approx. 10 min.
- Net weight:75 lbs - 34 kg
- connection inert gas N2
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