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HA06 SMT Reflow Oven
Part #: HA06
Lead Time: 2-4 weeks
Quick Overview
HA06 lead free SMT batch Reflow / quartz Oven system includes the option for nitrogen (N2) inlet that will allow you to process printed circuit boards in oxygen free ambiance, Nitrogen environment allows reduction of peak temperatures therefore nitrogen improves paste spread, increases wet ability, and produces shinier, more aesthetically pleasing solder joints.
This oven is perfect for your challenging lead free prototype PCB assembly projects.
An energy efficient mixture of quartz infrared and hot-air convection, two heating zones with temperature control provides accurate heating at the higher temperatures required for lead-free soldering, 12" X 15" 300 mm x 370 mm reflow area, cures SMD adhesive.
HA06 SMT Reflow Oven
HA06 lead free SMT batch Reflow / quartz Oven system includes the option for nitrogen (N2) inlet that will allow you to process printed circuit boards in oxygen free ambiance, Nitrogen environment allows reduction of peak temperatures therefore nitrogen improves paste spread, increases wet ability, and produces shinier, more aesthetically pleasing solder joints.
This oven is perfect for your challenging lead free prototype PCB assembly projects.
An energy efficient mixture of quartz infrared and hot-air convection, two heating zones with temperature control provides accurate heating at the higher temperatures required for lead-free soldering, 12" X 15" 300 mm x 370 mm reflow area, cures SMD adhesive.
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| Model |
HA06 |
| Power requirements: |
208/240 V 1 phase 50/60 Hz. |
| Rated power max. |
3650 W. |
| Max. Substrate surface: |
12" X 15" = 300 mm x 370. |
| Number of heating zones: |
2, microprocessor controlled. |
| Preheat time: |
0-999 sec. |
| Preheat temp: |
140-500°F - 60-260°C. |
| Reflow Time: |
0-999 sec. |
| Reflow temp: |
194-572°F - 90-300°C. |
| Heat up time to thermal stabilization: |
approx. 8 min. |
| Net weight: |
40 lbs - 18 kg=. |
| All specifications are subject tot change without notice. |
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| Warranty= 12 month |
HA06 lead free SMT batch Reflow / quartz Oven system includes the option for nitrogen (N2) inlet that will allow you to process printed circuit boards in oxygen free ambiance, Nitrogen environment allows reduction of peak temperatures therefore nitrogen improves paste spread, increases wet ability, and produces shinier, more aesthetically pleasing solder joints. This oven is perfect for your challenging lead free prototype circuit board assembly projects.
An energy efficient mixture of quartz infrared and hot-air convection, two heating zones with temperature control provides accurate heating at the higher temperatures required for lead-free soldering, 12" X 15" 300 mm x 370 mm reflow area, cures SMD adhesive.
- Power requirements: 208/240 V 1 phase 50/60 Hz.
- Rated power max. 3650 W.
- Max. Substrate surface: 12" X 15" 300 mm x 370 mm..
- Number of heating zones: 2, microprocessor controlled.
- Preheat time:0-999 sec.
- Preheat temp:140-500°F - 60-260°C.
- Reflow Time: 0-999 sec.
- Reflow temp:194-572°F. - 90-300°C.
- Heat up time to thermal stabilization: approx. 8 min.
- Net weight: 40 lbs-18 kg.
- Options: connection inert gas N2 with flow meter.
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