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GW-10A-HT Solder Fountain Selective Soldering
Part #: GW-10A-HT
Lead Time: 10 weeks
Data Sheet 
Quick Overview
The Gold-Wave™ High temperature, lead-free Soldering Fountain used for removal and replacement of through-hole components, connectors, etc. mounted on printed circuit boards.
GW-10A-HT Solder Fountain Selective Soldering
The Gold-Wave™ High temperature, lead-free Soldering Fountain used for removal and replacement of through-hole components, connectors, etc. mounted on printed circuit boards.
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| Model |
GW-10A-HT |
| Power |
120 VAC, 60 Hz, 15 A
optional 220 VAC, 50/60 Hz, 8 A |
| Max solder temp |
300°C (662°F) |
| Solder capacity |
50 lbs (23Kg) |
| >Dimensions |
16”x26”x 17”
(406x660x432 mm) |
| Warm-up time |
Approx. 30-45 min |
| Weight |
30 lbs empty (13.5Kg)
80 lbs (36 Kg) with solder |
| GW-UBF |
Universal X, Y, & Z Board Fixture Option
for board sizes up to 11” x 16.5” (280 x 420 mm) |
| Compresed air |
60 PSI (4 bar) |
| GW-10A - HT |
Solder Fountain with blow-through air nozzle |
The Gold-Wave™ High temperature, lead-free Solder Fountain with blow-thru air nozzle, used for removal and replacement of through-hole components, connectors, etc. mounted on printed circuit boards.
Key features:
- Microprocessor based digital controller that regulates solder temperature, wave height, and solder flow duration
- 10 menu storage
- Overhead locator laser light pinpoints position for centering components over the wave
- Height adjustable stainless steel platform
- Univeral X, Y, & Z Board Fixture Option for circuit board sizes up to 11" x 16.5" (280 x 420mm)
- High temperature 350°C (662°F), compatible with lead-free operation
- A large selection of nozzles for all component sizes is available. (14-20 pin DIP standard)
- Easy to change bayonet mount nozzles for a variety of rework or selective soldering applications.
X, Y and Z Universal Board Fixture Option |
Blow-thru Option |
Custom nozzles are also available |
A large selection of nozzles for all component sizes is available |
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