||43.30" x 28.34" x 24.40" or 1100mm x 720mm x 620mm
||About 330.69Lb or 150kg
||Max 9.84" x 11.81" or 250mm x 300mm, Min 1.18" x 0.39" or 30mm x 10mm
||Max 0.7" x 0.7" or 18mm x 18mm, Min 0.27" x 0.27" or 7mm x 7mm(1.88" x 1.88" or 48mm x 48mm optional)
|Temperature control system
||Model K intelligent system, closed loop control
|PCB transmissiom &drive system
||Precisely manual move
|Contraposition drive system
||Step motor laser
|Planting ball table configuration
|PCB transmissiom system
The BGA3200 rework table include BGA mounter system, transmission system and weld system. It is use to rework and weld BGA and CSP chips. Achieve surface mounter pin and PCB surface board imaging synchronously and contraposition exactly. Accomplish BGA chips unsoldering and rewelding. It is similar to high precision components, such as QFP and PLCC.
Characteristic of mounter and transmission system:
- Special precision apparatus beeline trace and flat rotation could achieve 2m resolving power in the range of 13mm and 2 degree exact regulation.
- Lambency double color technology, red LED illuminate on chips while green on PCB surface board. The intensity of the ray could be controlled to strengthen the image contrast.
- Advanced optic system makes the imaging of BGA and PCB at the same time, and improves the definition of image.
- High definition CCD outputs PAL and VGA signals to achieve the contact of industry monitor and PC display. 50X optics magnifier make the orientation easy and accurate.
- Industry Diaphragm Pumps improve big size BGA mounter efficiency especially to the heavy metal encapsulation BGA.
- Professional nozzle has a reliable and steady suction to pick up the chips cooperating with Industry Diaphragm Pumps.
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