BGA3100 Counter soldering system

BGA3100 Counter soldering system

Part #: BGA3100
Lead Time: 2 weeks
The BGA3100 rework table include BGA mounter system, transmission system and weld system. It is use to rework and weld BGA and CSP chips. Achieve surface mounter pin and PCB surface board imaging synchronously and contraposition exactly.
Dimensions 43.30" x 28.34" x 24.40" or 1100mm x 720mm x 620mm
Weight About 264.55Lb or 120kg
Total Power 1800W
Nozzle Heating 550W
Bottom Warm-up 1200W
Pressure 220V/50HZ
PCB Size Max 9.84" x 11.81" or 250mm x 300mm, Min 1.18" x 0.32" or 30mm x 10mm
PCB Thickness 0.5-3mm
Mounter Size Max 0.7" x 0.7" or 18mm x 18mm, Min 0.27" x 0.27" or 7mm x 7mm(1.88" x 1.88" or 48mm x 48mm optional)
Mounter Precision 10um
Picking-up Power 1.0N
Temperature control system Model K intelligent system, closed loop control
Contraposition system Automatic contraposition
PCB transmissiom &drive system Precisely manual move
Contraposition drive system Step motor laser
Planting ball table configuration Optional
PCB transmissiom system Manual

The BGA3100 rework table include BGA mounter system, transmission system and weld system. It is use to rework and weld BGA and CSP chips. Achieve surface mounter pin and PCB surface board imaging synchronously and contraposition exactly. Accomplish BGA chips unsoldering and rewelding. It is similar to high precision components, such as QFP and PLCC.
Characteristic of mounter and transmission system:

  • Special precision apparatus beeline trace and flat rotation could achieve 2m resolving power in the range of 13mm and 2 degree exact regulation.
  • Lambency double color technology, red LED illuminate on chips while green on PCB surface board. The intensity of the ray could be controlled to strengthen the image contrast.
  • Advanced optic system makes the imaging of BGA and PCB at the same time, and improves the definition of image.
  • High definition CCD outputs PAL and VGA signals to achieve the contact of industry monitor and PC display. 50X optics magnifier make the orientation easy and accurate.
  • Industry Diaphragm Pumps improve big size BGA mounter efficiency especially to the heavy metal encapsulation BGA.
  • Professional nozzle has a reliable and steady suction to pick up the chips cooperating with Industry Diaphragm Pumps.

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Price:  $15,441.18