The BGA1600+ Repair workstation is a new product for the BGA chip repairing market. It deals with BGA, CSP, LGA (Land Grid Array), Micro SMD, MLF (Micro-Lead Frame), BCC (Bumped Chip Component) and assemble rework system for super dense foot chip. It is convenient and stable for all kinds of PCB, especially for large size PCBs.

• Adopts best heating material to control disassemble and weld for BGA.
• Hot air and temperature can be adjusted, and the generated high temperatures rotates air.
• Moving heating head, easy operation.
• Temperature can be controlled independently on the top and bottom. Heating temperature can be displayed.
• A Large powered motor fan can cool rapidly PCBs to perfection.
• Hot air nozzle with different sizes. It is easy to replace.
• Capable of adjusting PCB's frames with anti-scald protection design.
• Support frame in the BGA welding district, adjust support height to avoid going down from the welding district.
• 20 segments warm-up control, it can save 2 groups setting temperature profiles.
• Alarm and reminder functions after disassembly and weld.
• The circuit can cut off when short-circuit.
• Super temperature protection function.
• Hand vacuum absorb pen to absorb BGA, the suction can be adjusted.
• It is suitable for lead and lead free welding.