||Solder paste, red gum, stencil, bare PCB, BGA/CSP/FC
||Height, volume, area, 3D profile, 2D distance
||Low power laser(Wavelength 660nm, Power 5mW)
||Height 0.5μm, Side(X,Y):6μm
||Height: < 1%, Volume: < 1% at 3 sigma
||3D Open GL
||Manual/Half-auto/Auto measurement, Fast programming / one-click repeated job on the same devices
Full prototype PCB scan, zoom and navigation,3D simulation to get real paste feature, Powerful SPC functions
||Product information including product name/line/paste specification/marks location stencil info,
Measurement including max height/min height/average height/area/volume
SPC： X-BAR,R-CHART,Histogram CP/Cpk/PP/PPK
|Size & Weight
It is an established fact that many defects are attributed to the solder paste printing process and solder joint formation.
It is also a known fact that solder paste volume is an important predictor of good quality solder joints and long-term reliability of solder joints.
Knowing that, process control has become a key element in the success of finer pitch devices, like 0201’s, CSP’s, BGA’s (ball grid array), CCGA’s (ceramic column grid array) which have known requirements for volume.Laser triangle measurement
Cut costs through process improvement and defect detection and elimination, thus building profits and providing competitive and robust PCB assembly processes.
High speed camera and image analyse Thechnology which can handle 01005 chip easyly
Autofocus against PCB warping compensation by Z-axis moving. 100 Profiles/sec/li>
The craft parameter adjust advise is provided by the professional SPC tool.
An Excel report is provided automatically
Operating System used is Windows XP
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