AL-Q6000 3D Solder paste Inspection system

AL-Q6000 3D Solder paste Inspection system

Part #: AL-Q6000
AL-Q6000 3D Stencil Printer Inspection System |Prototype PCB | Prototype PCB Assembly
AL-Q6000 3D Solder paste Inspection (SPI) system, is a system that can identify any problem caused in Screen printing. This 3D SPI is essential to avoid sending poorly prototype PCB devices downstream or compromising the long-term reliability of devices being built.

Model AL-Q6000
Applications Solder paste, red gum, stencil, bare PCB, BGA/CSP/FC
Measurement Height, volume, area, 3D profile, 2D distance
Software Language Chinese/English
Lights Low power laser(Wavelength 660nm, Power 5mW)
Speed 100 Profiles/sec
Resolution Height 0.5μm, Side(X,Y):6μm
Repeatability Height: < 1%, Volume: < 1% at 3 sigma
3D Mode 3D Open GL
Main Functions Manual/Half-auto/Auto measurement, Fast programming / one-click repeated job on the same devices
Full prototype PCB scan, zoom and navigation,3D simulation to get real paste feature, Powerful SPC functions
SPC Software Product information including product name/line/paste specification/marks location stencil info,
Measurement including max height/min height/average height/area/volume SPC: X-BAR,R-CHART,Histogram CP/Cpk/PP/PPK
Comp System Windows XP
Power Supply 85~230V,60/50Hz
Size & Weight 570(W)×700(L)×450(H)mm 80kg
It is an established fact that many defects are attributed to the solder paste printing process and solder joint formation. It is also a known fact that solder paste volume is an important predictor of good quality solder joints and long-term reliability of solder joints. Knowing that, process control has become a key element in the success of finer pitch devices, like 0201’s, CSP’s, BGA’s (ball grid array), CCGA’s (ceramic column grid array) which have known requirements for volume.

Main features
  • Laser triangle measurement
  • Cut costs through process improvement and defect detection and elimination, thus building profits and providing competitive and robust PCB assembly processes.
  • High speed camera and image analyse Thechnology which can handle 01005 chip easyly
  • Autofocus against PCB warping compensation by Z-axis moving. 100 Profiles/sec/li>
  • The craft parameter adjust advise is provided by the professional SPC tool.
  • An Excel report is provided automatically
  • Operating System used is Windows XP
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    Price:  $29,000.00