717D is a Halogen free, water-soluble solder paste designed for surface mount and other electronic assembly (Printed Circuit Board assembly) applications using a syringe dispensing method.Excellent dot-to-dot consistency, Eliminates the use of solvents and Residues are easily removed with warm water.

The melting temperature of the solder and the heat resistance of components determine reflow Profile. 717D can be processed in most reflow media, (i.e. IR, Vapor-phase, Forced convection,etc). Ramp rate of 2.5-3.0°C per second is desirable, since most components are rated for 4.0°C per second.
The solder paste type 717D is water soluble formulation therefore the residues need to be removed. Residue removal is easily achieved,with the use of hot 60 °C (140 °F) de-ionized water in either a batch or conveyorized cleaner. Spray pressures should be maintained at 20-30 psi and conveyor speed of 3-6ft/min.