DESCRIPTION
619D is a Halogen free, water-soluble solder paste designed for surface mount printed circuit board assembly applications using a syringe dispensing method.

Material Safety Data Sheets (MSDS)
Solder Paste Type 619D -MSDS

BENEFITS

• Bellcore compliant
• Excellent dot-to-dot consistency
• Non corrosive
• Pin Testable post solder residue
• Excellent wetting on OSP
• No cleaning required

APPLICATION - NEEDLE GAUGE / PARTICLE SIZE

14 - 18:		Use -200+325 mesh
20 - 23:		Use -325+500 mesh
25:		Use -400+635 mesh
27:		Use -500 mesh

Alloys:Sn63/Pb37, Sn62/Pb36/Ag2, etc.
(Meets J-STD-006 Specification)
METAL CONTENT – 88%

REFLOW PROFILE.
The melting temperature of the solder and the heat resistance of components determine reflow Profile. 619D can be processed in most reflow media, (i.e. IR, Vapor-phase, Forced convection,etc.). Ramp rate of 2.5-3.0°C per second is desirable, since most components are rated for 4.0°C per second.
PHYSICAL / CHEMICAL CHARACTERISTICS

Color and Appearance:	Metallic Gray
Copper Mirror Test	Pass/No breakthrough
Silver Chromate (Chloride & Bromide Test)	Pass/No discoloration
Surface Insulation Resistance-Ohms
J-STD-004	>1.0 x 1010
Slump Test	Pass
Electromigration,3	Pass
pH-5% Aqueous Solution (Flux Extract)	6.0-8.0
Softening Point	94O°C
Viscosity
Malcom1	85 -110 kcps, 88% metal
Brookfield2	300 - 400 kcps +/- 10%, 88% metal

SHIPPING & STORAGE

Recommended Storage Temperature

35°-50°F

SHELF LIFE

Unopened Container	35°-50°F	6 Months (from DOM)
	77°F	1 Months (from DOS)

1. Malcom PCU-Series, 10 RPM, 25°C
2. Brookfield RVTD, TF spindle, 5 RPM, 25°C,0.75” spindle depth

Delta ® is a registered trademark of Qualitek International, Inc.